Highly parallel optical communication system with intracard and intercard communications

• US 7,653,272 B2
• Filed: 09/19/2002
• Issued: 01/26/2010
• Est. Priority Date: 09/19/2002
• Status: Active Grant

• Current Assignee: Broadcom International Pte Ltd. (Broadcom, Inc.)
• Original Assignee: Avago Technologies Fiber IP Singapore PTE Limited (Broadcom, Inc.)
• Inventors: Buckman, Lisa A., Cham, Kit M.
• Primary Examiner(s): MACCHIAROLO, PETER J
• Application Number:
  US10/252,145
• Publication Number:
  US 20040213503A1
• Time in Patent Office: 2,686 Days
• Field of Search: 385/14, 385 16- 19, 385/47, 385/130, 385/131, 385/8, 385/88, 398/55, 398/56
• US Class Current: 385/17
• CPC Class Codes: G02B 6/3512 the optical element being reflective, e.g. mirror
• CPC Class Codes: G02B 6/3546 NxM switch, i.e. a regular array of switches elements of matrix type constellation
• CPC Class Codes: G02B 6/3596 With planar waveguide arrangement, i.e. in a substrate, regardless if actuating mechanism is outside the substrate
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Abstract

An optical communications system including a method and apparatus with an electro-optical chip which includes optical interface elements in optical interface array configuration on a first side of the electro-optical chip, attached to or integrated with an optical circuit board which includes a plurality of layered optical wave guides, a plurality of coupling elements disposed relative to the electro-optical chip such that the plurality of coupling elements optically communicate with the first plurality of optical interface elements on the electro-optical chip, and wherein the coupling elements are further disposed to optically communicate with the plurality of optical wave guides.

Claims

1. An optical communications system, comprising:

at least one electro-optical chip;

a circuit board;

a plurality of optical interface elements between the at least one electro-optical chip and the circuit board for directing light in a first direction;

a plurality of optical waveguides arranged in layers on the circuit board for directing light in second directions different from the first direction; and

a plurality of optical coupling elements between the plurality of optical interface elements and the plurality of optical waveguides, each of the plurality optical coupling elements redirecting light between one of the plurality of optical interface elements and one of the plurality of optical waveguides.

2. The optical communications system according to claim 1, wherein the second directions are transverse to the first direction.

3. The optical communications system according to claim 1, wherein at least one of the plurality of optical coupling elements redirects light from one of the plurality of optical interface elements to one of the plurality of optical waveguides.

4. The optical communications system according to claim 1, wherein at least one of the plurality of optical coupling elements redirects light from one of the plurality of optical waveguides to one of the plurality of optical interface elements.

5. The optical communications system according to claim 1, wherein at least one of the plurality of optical coupling elements comprises a reflecting element.

6. The optical communications system according to claim 5, wherein the reflecting element comprises a micro mirror.

7. The optical communications system according to claim 1, wherein at least one of the plurality of optical coupling elements comprises a diffractive element.

8. The optical communications system according to claim 1, wherein the at least one electro-optical chip is assembled to the circuit board.

9. The optical communications system according to claim 1, wherein the at least one electro-optical chip includes at least one semiconductor laser.

10. The optical communications system according to claim 1, wherein the at least one electro-optical chip includes at least one vertical cavity surface emitting laser.

11. The optical communications system according to claim 1, wherein the at least one electro-optical chip includes at least one high speed photodetector.

12. The optical communications system according to claim 1, wherein the plurality of optical interface elements comprises a first plurality of optical interface elements on a first side of the at least one electro-optical chip, and wherein the system further includes a second plurality of optical interface elements on a second side of the at least one electro-optical chip for providing optical communication between the at least one electro-optical chip and an optical element.

13. The optical communications system according to claim 12, wherein the second plurality of optical interface elements provide optical communication between the at least one electro-optical chip and the optical element across a free space.

14. The optical communications system according to claim 13, wherein the at least one electro-optical chip comprises a first electro-optical chip, and wherein the optical element comprises a second electro-optical chip.

15. The optical communications system according to claim 14, wherein the circuit board comprises a first circuit board, and wherein the system further includes a second circuit board having a second plurality of optical waveguides in optical communication with the second electro-optical chip.

16. A method for communicating data comprising:

providing at least one electro-optical chip having a plurality of optical interface elements for directing light in a first direction;

providing a circuit board having a plurality of optical waveguides arranged in layers for directing light in second directions different from the first direction; and

providing a plurality of optical coupling elements between the plurality of optical interface elements and the plurality of optical waveguides, each of the plurality optical coupling elements redirecting light between one of the plurality of optical interface elements and one of the plurality of optical waveguides.

17. The method according to claim 16, and further including assembling the at least one electro-optical chip to the circuit board.

18. The method according to claim 16, wherein providing a plurality of optical coupling elements between the plurality of optical interface elements and the plurality optical waveguides comprises providing a plurality of reflecting elements between the plurality of optical interface elements and the plurality optical waveguides, each of the plurality of reflecting elements reflecting light between one of the plurality of optical interface elements and one of the plurality of optical waveguides.

19. The method according to claim 16, wherein the at least one electro-optical chip comprises a first electro-optical chip having a first plurality of optical interface elements, and wherein the method further includes providing optical communication between the first electro-optical chip and a second electro-optical chip through a second plurality of optical interface elements.

20. The method according to claim 19, wherein providing optical communication between the first electro-optical chip and the second electro-optical chip comprises providing optical communication between the first electro-optical chip and the second electro-optical chip across an open space.