Electrode structure and methods for making and using same

• US 7,653,439 B2
• Filed: 12/17/2004
• Issued: 01/26/2010
• Est. Priority Date: 12/19/2003
• Status: Expired due to Fees

• Current Assignee: Heraeus Deutschland GmbH & Co. KG (Heraeus Holding GMBH)
• Original Assignee: WC Heraeus GmbH (Heraeus Holding GMBH)
• Inventors: Specht, Heiko, Kruger, Frank
• Primary Examiner(s): Layno; Carl H
• Assistant Examiner(s): MALAMUD, DEBORAH LESLIE
• Application Number:
  US11/015,629
• Publication Number:
  US 20050154436A1
• Time in Patent Office: 1,866 Days
• Field of Search: 607116-138, 600373-391, 427/2.1, 427/2.24, 428/35.7, 428/35.8
• US Class Current: 607/116
• CPC Class Codes: A61N 1/0541 Cochlear electrodes
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: Y10T 428/1352 Polymer or resin containing [i.e., natural or synthetic]
• CPC Class Codes: Y10T 428/1355 Elemental metal containing [e.g., substrate, foil, film, coating, etc.]

Abstract

An electrode structure made of noble metal or a noble metal alloy having a thickness of ≦100 μm is provided for implants. The electrode structure has an electrode core made of gold, silver, copper, or an alloy of at least two of these elements, and the electrode core is completely encased by a first coating, which is formed from platinum, iridium, or ruthenium.

Claims

1. A method for producing an electrode structure (10) for implants, comprising a noble metal or a noble metal alloy having a thickness of ≦

100 μ

m, wherein the electrode structure (10) has an electrode core (12) comprising an element selected from the group consisting of gold, silver, copper, and alloys of at least two of these elements, and wherein the electrode core (12) has a thickness in a range of about 5 μ

m to 99.8 μ

m and is encased completely by a first coating (13;

13a, 13b) comprising at least one element selected from the group consisting of platinum, iridium, and ruthenium, the method comprising;

a) coating an electrically insulating surface (14a) of a substrate (14) with a metal layer (15), then coating the metal layer (15) with a photoresist (16), and structuring the photoresist (16),

b) galvanically generating a first part (13a) of the first coating on regions of the metal layer (15) exposed by the structured photoresist,

c) galvanically forming the electrode core (12) on the first part (13a) of the first coating,

d) then removing the structured photoresist (16) from the metal layer (15),

e) removing the metal layer (15) from the electrically insulating surface (14a) of the substrate (14) in regions not covered by the first part (13a) of the first coating,

f) galvanically coating part of the electrode core (12) still free up to now from the first coating with a second part (13b) of the first coating,

g) detaching the electrode structure (10) including the metal layer (15) from the electrically insulating surface (14a) of the substrate (14), and

h) then removing the metal layer (15) from the electrode structure (10).

2. The method according to claim 1, wherein the electrically insulating surface (14a) of the substrate (14) comprises glass or plastic.

3. The method according to claim 1, wherein the metal layer (15) comprises copper or gold.

4. A method for producing an electrode structure (10) for implants, comprising a noble metal or a noble metal alloy having a thickness of ≦

100 μ

m, wherein the electrode structure (10) has an electrode core (12) comprising an element selected from the group consisting of gold, silver, copper, and alloys of at least two of these elements, and wherein the electrode core (12) has a thickness in a range of about 5 μ

m to 99.8 μ

m and is encased completely by a first coating (13;

13a, 13b) comprising at least one element selected from the group consisting of platinum, iridium, and ruthenium, the method comprising;

a) providing an electrically insulating surface (14a) of a substrate (14) with a mask, and forming a metal layer (15) by cathode sputtering or vapor deposition on regions of the electrically insulating surface (14a) not covered with the mask,

b) generating a first part (13a) of the first coating by cathode sputtering or vapor deposition on the metal layer (15),

c) then forming the electrode core (12) by cathode sputtering or vapor deposition on the first part (13a) of the first coating,

d) then removing the mask,

e) galvanically coating at least part of the electrode core (12) still free up to now from the first coating (3a, 3b) with a second part (13b) of the first coating, and

f) then detaching the electrode structure (10) from the electrically insulating surface (14a) of the substrate (14) such that the metal layer (15) is removed.

5. The method according to claim 4, wherein the electrically insulating surface (14a) of the substrate (14) comprises glass or plastic.

6. The method according to claim 4, wherein the metal layer (15) comprises copper or gold.

7. A method for producing an electrode structure (10) for implants, comprising a noble metal or a noble metal alloy having a thickness of ≦

100 μ

m, wherein the electrode structure (10) has an electrode core (12) comprising an element selected from the group consisting of gold, silver, copper, and alloys of at least two of these elements, and wherein the electrode core (12) has a thickness in a range of about 5 μ

m to 99.8 μ

m and is encased completely by a first coating (13;

13a, 13b) comprising at least one element selected from the group consisting of platinum, iridium, and ruthenium, the method comprising;

a) coating an electrically insulating surface (14a) of a substrate (14) with a structured metal layer, which forms a first part (13a) of the first coating,

b) providing the first part (13a) of the first coating with a mask, and forming the electrode core (12) by cathode sputtering or vapor deposition only on the first part (13a) of the first coating,

c) then galvanically coating part of the electrode core (12) still free up to now from the first coating (3a) with a second part (13b) of the first coating, and

d) then detaching the electrode structure (10) from the electrically insulating surface (14a) of the substrate (14).

8. The method according to claim 7, wherein the electrically insulating surface (14a) of the substrate (14) comprises glass or plastic.

9. An electrode structure (10) for implants, comprising a noble metal or a noble metal alloy having a thickness of ≦

100 μ

m, wherein the electrode structure (10) has an electrode core (12) comprising an element selected from the group consisting of gold, silver, copper, and alloys of at least two of these elements, wherein the electrode core (12) has a thickness in a range of about 5 μ

m to 99.8 μ

m and is encased completely by a first coating (13;

13a, 13b) comprising at least one element selected from the group consisting of platinum, iridium, and ruthenium, and wherein the electrode structure is in a form selected from the group consisting of stimulation electrodes, cochlear electrodes, and retinal electrodes.