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Method of fabricating an RF MEMS switch with spring-loaded latching mechanism

  • US 7,653,985 B1
  • Filed: 06/27/2007
  • Issued: 02/02/2010
  • Est. Priority Date: 10/07/2004
  • Status: Active Grant
First Claim
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1. A method of fabricating a switch comprising:

  • providing a substrate;

    etching one or more recesses in the substrate;

    depositing first conductive material on the substrate;

    depositing a support layer on the first conductive material and the substrate;

    depositing a first beam structural layer on the support layer;

    etching one or more portions of the first beam structural layer and the support layer down to one or more portions of the first conductive material to form recesses for vias, comb actuator posts, and switch anchor posts;

    etching at least one other portion of the first beam structural layer to provide a tip recess;

    depositing second conductive material on portions of the first beam structural layer, in the vias, and in the tip recess;

    depositing a second beam structural layer on the first beam structural layer and on at least some portions of the second conductive material; and

    removing the support layer.

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