Method of fabricating an RF MEMS switch with spring-loaded latching mechanism
First Claim
1. A method of fabricating a switch comprising:
- providing a substrate;
etching one or more recesses in the substrate;
depositing first conductive material on the substrate;
depositing a support layer on the first conductive material and the substrate;
depositing a first beam structural layer on the support layer;
etching one or more portions of the first beam structural layer and the support layer down to one or more portions of the first conductive material to form recesses for vias, comb actuator posts, and switch anchor posts;
etching at least one other portion of the first beam structural layer to provide a tip recess;
depositing second conductive material on portions of the first beam structural layer, in the vias, and in the tip recess;
depositing a second beam structural layer on the first beam structural layer and on at least some portions of the second conductive material; and
removing the support layer.
1 Assignment
0 Petitions
Accused Products
Abstract
Disclosed are methods for fabricating a micro-electro-mechanical switch. The switch has a cantilever arm disposed on a substrate that can be moved in orthogonal directions for latching and unlatching. For latching, the cantilever arm is moved back by a comb-drive actuator and then pulled down by electrodes disposed on the substrate and the cantilever arm. The comb-drive actuator switch is then released and the cantilever arm moves forward to be captured by a dove-tail structure on the substrate. When the voltage is removed, the cantilever arm is held in place by the dove-tail structure. The switch is unlatched by actuating the comb-drive actuator to move the cantilever arm away from the dove-tail structure. The cantilever arm will then pop up once it is released from the dove-tail structure.
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Citations
9 Claims
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1. A method of fabricating a switch comprising:
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providing a substrate; etching one or more recesses in the substrate; depositing first conductive material on the substrate; depositing a support layer on the first conductive material and the substrate; depositing a first beam structural layer on the support layer; etching one or more portions of the first beam structural layer and the support layer down to one or more portions of the first conductive material to form recesses for vias, comb actuator posts, and switch anchor posts; etching at least one other portion of the first beam structural layer to provide a tip recess; depositing second conductive material on portions of the first beam structural layer, in the vias, and in the tip recess; depositing a second beam structural layer on the first beam structural layer and on at least some portions of the second conductive material; and removing the support layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification