Mix of grafted and non-grafted particles in a resin

• US 7,655,295 B2
• Filed: 04/03/2006
• Issued: 02/02/2010
• Est. Priority Date: 06/14/2005
• Status: Expired due to Fees

• Current Assignee: Siemens Energy Incorporated (Siemens AG)
• Original Assignee: Siemens Energy Incorporated (Siemens AG)
• Inventors: Wood, John W., Stevens, Gary, Smith, James D. B.
• Primary Examiner(s): Feely; Michael J
• Application Number:
  US11/396,989
• Publication Number:
  US 20060281833A1
• Time in Patent Office: 1,401 Days
• Field of Search: None
• US Class Current: 428/308.8
• CPC Class Codes: C08G 59/4085 silicon containing compounds
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: Y10T 428/249953 Composite having voids in a component [e.g., porous, cellular, etc.]
• CPC Class Codes: Y10T 428/249955 Void-containing component partially impregnated with adjacent component
• CPC Class Codes: Y10T 428/249959 Void-containing component is wood or paper
• CPC Class Codes: Y10T 428/26 Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension

Abstract

In one application the mix grafted and non grafted invention provides for high thermal conductivity resin that comprises a host resin matrix with a first class of grafted high thermal conductivity particles that are grafted to the host resin matrix. Also a second class of non-grafted high thermal conductivity particles that are not directly grafted the host resin matrix. The first class and the second class comprise approximately 2-60% by volume of the high thermal conductivity resin. The first class of grafted particles and the second class of non-grafted particles are high thermal conductivity fillers are from 1-1000 nm in length, and have an aspect ratio of between 3-100.

Claims

1. A high thermal conductivity resin comprising:

a host resin matrix;

a first class of high thermal conductivity particles that are grafted to said host resin matrix; and

a second class of high thermal conductivity particles that are not directly grafted to said host resin matrix;

wherein said first class of particles and said second class of particles, together, occupy approximately 2-60% by volume of said high thermal conductivity resin;

wherein said first class of particles and said second class of particles are from 1-1000 nm in length and have an aspect ratio of between 3-100.

2. The resin of claim 1, wherein said first class of particles and said second class of particles, together, occupy approximately 25-40% by volume of said high thermal conductivity resin.

3. The resin of claim 1, wherein said second class of particles has been surface treated to not react with other particles of their class.

4. The resin of claim 1, wherein said second class of particles has been surface treated to react with other particles of their class to form aggregations within the host resin matrix.

5. The resin of claim 1, wherein said first class of particles has been surface treated to react with said second class of particles.

6. The resin of claim 1, wherein said first class of particles has an average length distribution at least ten times greater than said second class of particles.

7. The resin of claim 1, wherein said host resin network includes at least one of epoxy, polyimide epoxy, liquid crystal epoxy, cyanate-ester, polybutadiene, or mixtures thereof.

8. A composite tape impregnated with the high thermal conductivity resin of claim 1.

9. The resin of claim 1, wherein said first class of particles becomes grafted to said host resin matrix by the application of at least one of increased temperature or ultraviolet light.

10. The resin of claim 1, wherein the first class of particles and said second class of particles comprise at least one of oxides, nitrides, or carbides.

11. A high thermal conductivity resin comprising:

a host resin matrix;

a first class of high thermal conductivity particles that are grafted to said host resin matrix; and

a second class of high thermal conductivity particles that are not grafted to said host resin matrix;

wherein said first class of particles and said second class of particles, together, occupy approximately 4-60% by volume of said high thermal conductivity resin;

wherein said first class of particles and said second class of particles are from 5-1000 nm in length and have an aspect ratio of between 3-100;

wherein each of said first class of particles and said second class of particles occupy at least 1% by volume of said high thermal conductivity resin.

12. A porous media impregnated with the high thermal conductivity resin of claim 11.

13. The impregnated porous media resin of claim 12, wherein the porous media is a paper matrix.

14. The impregnated porous media resin of claim 12, wherein the ratio of said first class of particles and said second class of particles is different in different parts of said porous media due to a greater filtering effect that the porous media has on said second class of particles.

15. The impregnated porous media of claim 12, wherein the ratio of said first class of particles and said second class of particles is different in different parts of said porous media due to the original positioning of the particles.

16. The resin of claim 11, wherein said first class of particles has a higher mechanical strength than said second class of particles.

17. A high thermal conductivity resin comprising:

a host resin matrix;

a first class of particles that are grafted to said host resin matrix, wherein said first class of particles increase a local strength of said host resin matrix; and

a second class of particles that are not grafted to said host resin matrix;

wherein said first class of particles and said second class of particles, together, occupy approximately 2-60% by volume of said high thermal conductivity resin;

wherein said second class of particles are high thermal conductivity fillers from 1-1000 nm in length having an aspect ratio of between 3-100.

18. The resin of claim 17, wherein said second class of particles has an average length of 2-10 times that of said first class of particles.

19. The resin of claim 17, wherein at least a portion of said first class of particles are high thermal conductivity fillers from 1-1000 nm in length having an aspect ratio of between 3-100.

20. The resin of claim 17, further comprising a third class of particles that are not grafted to said host resin matrix, are not high thermal conductivity particles, and are present in said host resin matrix.

21. The resin of claim 17, wherein said first class of particles increases a dielectric strength of said host resin matrix.