Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
First Claim
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1. A method for making a plurality of spatial light modulators, the method comprising:
- providing a transparent wafer and a semiconductor wafer;
forming a plurality of micromirrors on the semiconductor wafer within each of a plurality of rectangular active areas, wherein the plurality of micromirrors within each rectangular active area form a micromirror array on the semiconductor wafer, and wherein the micromirrors have mirror edges that are neither parallel nor perpendicular to edges of the rectangular active area;
bonding the transparent wafer and semiconductor wafer together with a spacer layer therebetween, wherein the spacer layer encircles each rectangular active area individually, so as to form a gap between the wafers in which the micromirrors of each respective rectangular active area are disposed;
wherein the bonding is performed by an application of an adhesive, an application of pressure to press the transparent wafer and semiconductor wafer together, and a step of curing the adhesive so as to form a wafer assembly; and
singulating the wafer assembly into individual spatial light modulators.
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Abstract
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
191 Citations
40 Claims
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1. A method for making a plurality of spatial light modulators, the method comprising:
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providing a transparent wafer and a semiconductor wafer; forming a plurality of micromirrors on the semiconductor wafer within each of a plurality of rectangular active areas, wherein the plurality of micromirrors within each rectangular active area form a micromirror array on the semiconductor wafer, and wherein the micromirrors have mirror edges that are neither parallel nor perpendicular to edges of the rectangular active area; bonding the transparent wafer and semiconductor wafer together with a spacer layer therebetween, wherein the spacer layer encircles each rectangular active area individually, so as to form a gap between the wafers in which the micromirrors of each respective rectangular active area are disposed; wherein the bonding is performed by an application of an adhesive, an application of pressure to press the transparent wafer and semiconductor wafer together, and a step of curing the adhesive so as to form a wafer assembly; and singulating the wafer assembly into individual spatial light modulators. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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Specification