Semiconductor device free of gate spacer stress and method of manufacturing the same
First Claim
1. A method of fabricating a semiconductor device, the method comprising:
- forming isolation regions in a substrate;
forming a gate pattern on the substrate;
forming an L-type spacer layer which covers an upper region and sidewall of the gate pattern;
forming a gate spacer layer on the L-type spacer layer;
forming an L-type spacer on the sidewall of the gate pattern and extended to the substrate and a gate spacer by patterning the L-type spacer layer and the gate spacer layer, and simultaneously exposing a surface of the substrate between the gate spacer and the isolation regions;
forming a source/drain silicide region on the exposed substrate;
forming a sacrificial metal layer on the source/drain silicide region;
removing the gate spacer;
removing the sacrificial metal layer;
forming an interlayer dielectric layer which covers the gate pattern and the source/drain silicide region; and
forming via plugs electrically connected with the source/drain silicide region by vertically penetrating the interlayer dielectric layer.
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Abstract
A semiconductor device that prevents gate spacer stress and physical and chemical damages on a silicide region, and a method of manufacturing the same, according to an exemplary embodiment of the present invention, includes a substrate, isolation regions formed in the substrate, a gate pattern formed between the isolation regions on the substrate, an L-type spacer adjacent to the sidewall of the gate pattern and extended to the surface of the substrate, source/drain silicide regions formed on the substrate between the end of the L-type spacer extended to the surface of the substrate and the isolation regions, via plugs electrically connected with the source/drain silicide regions, an interlayer dielectric layer which is adjacent to the L-type spacer and which fills the space between the via plugs layer formed on the gate pattern and the substrate, and a signal-transfer line formed on the interlayer dielectric layer.
14 Citations
20 Claims
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1. A method of fabricating a semiconductor device, the method comprising:
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forming isolation regions in a substrate; forming a gate pattern on the substrate; forming an L-type spacer layer which covers an upper region and sidewall of the gate pattern; forming a gate spacer layer on the L-type spacer layer; forming an L-type spacer on the sidewall of the gate pattern and extended to the substrate and a gate spacer by patterning the L-type spacer layer and the gate spacer layer, and simultaneously exposing a surface of the substrate between the gate spacer and the isolation regions; forming a source/drain silicide region on the exposed substrate; forming a sacrificial metal layer on the source/drain silicide region; removing the gate spacer; removing the sacrificial metal layer; forming an interlayer dielectric layer which covers the gate pattern and the source/drain silicide region; and forming via plugs electrically connected with the source/drain silicide region by vertically penetrating the interlayer dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of fabricating a semiconductor device, the method comprising:
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forming isolation regions in a substrate; forming a gate pattern on the substrate; forming an L-type spacer layer which covers an upper region and sidewall of the gate pattern; forming a gate spacer layer on the L-type spacer layer; forming an L-type spacer on the sidewall of the gate pattern and extended to the substrate and a gate spacer by patterning the L-type spacer layer and the gate spacer layer; and exposing a surface of the substrate corresponding to between the gate spacer and the isolation regions; forming a source/drain silicide region on the exposed substrate; forming a source/drain pad metal layer on the source/drain silicide region; removing the gate spacer; forming an interlayer dielectric layer which covers the gate pattern and the source/drain silicide region; and forming via plugs electrically connected with the source/drain silicide region by vertically penetrating the interlayer dielectric layer. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
a gate electrode formed on the gate-insulating layer; and a gate silicide region formed on the gate electrode.
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14. The method of claim 13, wherein a lower part of the gate silicide region is not higher than a top of the L-type spacer.
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15. The method of claim 14, further comprising forming a gale pad metal layer on the gate silicide region.
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16. The method of claim 15, wherein the gate pad metal layer is extended to be formed on the sidewall of the gate silicide region.
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17. The method of claim 11, wherein the via plugs vertically penetrate the interlayer dielectric layer to form via holes which selectively expose a surface of the source/drain silicide region, and the method further comprises
forming a liner on a sidewall of the via holes and the surface of the source/drain silicide region; - and
filling the inside of the via holes with conductive material.
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18. The method of claim 17, wherein the surface of the source/drain silicide region is recessed while the via holes are formed.
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19. The method of claim 11, wherein the L-type spacer is a multi-layered structure comprising a combination of at least two selected from the group consisting of silicon oxide, silicon nitride, and silicon oxynitride.
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20. The method of claim 11, further comprising forming an etch stopper which covers the gate pattern and the source/drain silicide region before forming the interlayer dielectric layer.
Specification