Infrared detector elements and methods of forming same
First Claim
Patent Images
1. An infrared detector element, comprising:
- a microbolometer infrared radiation detector structure, said microbolometer infrared detector structure comprising a lead metal reflector;
wherein said lead metal reflector comprises an at least partially exposed planar top metal layer of read out integrated circuitry (ROIC) that is configured as said lead metal reflector for said microbolometer infrared detector structure.
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Abstract
Infrared detector elements and methods for forming infrared detector elements in which the top metal layer of CMOS circuitry of the detector element is employed as a lead metal reflector for the infrared detector.
113 Citations
37 Claims
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1. An infrared detector element, comprising:
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a microbolometer infrared radiation detector structure, said microbolometer infrared detector structure comprising a lead metal reflector; wherein said lead metal reflector comprises an at least partially exposed planar top metal layer of read out integrated circuitry (ROIC) that is configured as said lead metal reflector for said microbolometer infrared detector structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A focal plane array assembly, comprising:
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a substrate having a first side; and a plurality of microbolometer infrared detector elements, each of said plurality of microbolometer infrared detector elements comprising a membrane suspended over said first side of said substrate and a lead metal reflector disposed on said first side of said substrate between said suspended membrane and said substrate; wherein said lead metal reflector for each of said microbolometer infrared detector elements comprises an at least partially exposed planar top metal layer of read out integrated circuitry (ROIC) that is configured as said lead metal reflector for said microbolometer infrared detector structure. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of making a focal plane array assembly, comprising:
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providing a substrate having a first side; forming a lead metal reflector on said first side of said substrate, said lead metal reflector comprising an at least partially exposed planar top metal layer of read out integrated circuitry (ROIC) with an at least partially exposed and reflective upper surface; and forming a plurality of membrane structures on said first side of said substrate so that each of said membrane structures is suspended over said first side of said substrate with said at least partially exposed planar top metal layer of said ROIC disposed between said suspended membrane and said substrate. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37)
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Specification