Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
First Claim
1. A submount for a solid state lighting package, comprising:
- a support member having an upper surface, a first side surface, and a second side surface opposite the first side surface;
a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member;
a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending from the die mounting region toward the second side surface of the support member, wherein the die mounting region of the second electrical bondpad is configured to receive an electronic device, and wherein the extension region is configured to receive a wirebond; and
a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad;
wherein the second bonding region of the first electrical bondpad extends towards the second side surface of the support member past the die mounting region of the second electrical bondpad and wherein the extension region of the second electrical bondpad extends closer to the second side surface of the support member than the second bonding region of the first electrical bondpad.
3 Assignments
0 Petitions
Accused Products
Abstract
A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.
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Citations
32 Claims
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1. A submount for a solid state lighting package, comprising:
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a support member having an upper surface, a first side surface, and a second side surface opposite the first side surface; a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member; a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending from the die mounting region toward the second side surface of the support member, wherein the die mounting region of the second electrical bondpad is configured to receive an electronic device, and wherein the extension region is configured to receive a wirebond; and a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad; wherein the second bonding region of the first electrical bondpad extends towards the second side surface of the support member past the die mounting region of the second electrical bondpad and wherein the extension region of the second electrical bondpad extends closer to the second side surface of the support member than the second bonding region of the first electrical bondpad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A package for a plurality of light emitting devices, comprising:
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a body including an upper surface; a submount on the upper surface of the body, the submount having an upper surface, a first side surface, and a second side surface opposite the first side surface; a first electrical bondpad on the upper surface of the submount and having a first bonding region proximate the first side surface of the submount and a second bonding region extending toward the second side surface of the submount; a second electrical bondpad on the upper surface of the submount having a die mounting region proximate the first side surface of the submount and an extension region extending from the die mounting region toward the second side surface of the submount, wherein the die mounting region of the second electrical bondpad is configured to receive an electronic device, and wherein the extension region is configured to receive a wirebond; and a third electrical bondpad on the upper surface of the submount and positioned between the second side surface of the submount and the die mounting region of the second electrical bondpad; wherein the second bonding region of the first electrical bondpad extends towards the second side surface of the support member past the die mounting region of the second electrical bondpad and wherein the extension region of the second electrical bondpad extends closer to the second side surface of the support member than the second bonding region of the first electrical bondpad. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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Specification