Testing method using a scalable parametric measurement macro
First Claim
1. A testing method for chips, said method comprising:
- testing all chips from a lot after manufacture,wherein each chip comprises a parametric performance monitoring system on said chip, wherein said parametric performance monitoring system comprises at least one on-chip parametric measurement macro comprising a plurality of individually selectable test circuits to perform different types of tests,wherein each of said individually selectable test circuits comprises a device under test,wherein at least two devices under test comprise different types of devices under test, andwherein, for each chip, said testing comprises taking, by said parametric performance monitoring system on said chip, parametric measurements from said at least one on-chip parametric measurement macro, said parametric measurements comprising actual measured values for at least one parameter for each device under test and said at least one parameter comprising one of on current (Ion) and threshold voltage (Vt);
determining yield loss based on results of said testing of said all of said chips; and
correlating said yield loss with said parametric measurements to identify yield sensitivity to variations in said parametric measurements.
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Abstract
Disclosed are testing method embodiments in which, during post-manufacture testing, parametric measurements are taken from on-chip parametric measurement elements and used to optimize manufacturing in-line parametric control learning and/or to optimize product screening processes. Specifically, these post-manufacture parametric measurements can be used to disposition chips without shipping out non-conforming products, without discarding conforming products, and without requiring high cost functional tests. They can also be used to identify yield sensitivities to parametric variations from design and to provide feedback for manufacturing line improvements based on the yield sensitivities. Additionally, a historical database regarding the key parameters that are monitored at both the fabrication and post-fabrication levels can be used to predict future yield and, thereby, to preemptively improve the manufacturing line and/or also to update supply chain forecasts.
46 Citations
34 Claims
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1. A testing method for chips, said method comprising:
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testing all chips from a lot after manufacture, wherein each chip comprises a parametric performance monitoring system on said chip, wherein said parametric performance monitoring system comprises at least one on-chip parametric measurement macro comprising a plurality of individually selectable test circuits to perform different types of tests, wherein each of said individually selectable test circuits comprises a device under test, wherein at least two devices under test comprise different types of devices under test, and wherein, for each chip, said testing comprises taking, by said parametric performance monitoring system on said chip, parametric measurements from said at least one on-chip parametric measurement macro, said parametric measurements comprising actual measured values for at least one parameter for each device under test and said at least one parameter comprising one of on current (Ion) and threshold voltage (Vt); determining yield loss based on results of said testing of said all of said chips; and correlating said yield loss with said parametric measurements to identify yield sensitivity to variations in said parametric measurements. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A program storage device readable by computer and tangibly embodying a program of instructions executable by said computer to perform a testing method for chips, said method comprising:
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testing all chips from a lot after manufacture, wherein each chip comprises a parametric performance monitoring system on said chip, wherein said parametric performance monitoring system comprises at least one on-chip parametric measurement macro comprising a plurality of individually selectable test circuits to perform different types of tests, wherein each of said individually selectable test circuits comprises a device under test, wherein at least two devices under test comprise different types of devices under test, and wherein, for each chip, said testing comprises taking, by said parametric performance monitoring system on said chip, parametric measurements from said at least one on-chip parametric measurement macro, said parametric measurements comprising actual measured values for at least one parameter for each device under test and said at least one parameter comprising one of on current (Ion) and threshold voltage (Vt); determining yield loss based on results of said testing of said all of said chips; and correlating said yield loss with said parametric measurements to identify yield sensitivity to variations in said parametric measurements. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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19. A testing method for chips manufactured with on-chip parametric measurement macros, said method comprising:
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testing all chips from a lot after manufacture, wherein each chip comprises a parametric performance monitoring system on said chip, wherein said parametric performance monitoring system comprises at least one on-chip parametric measurement macro comprising a plurality of individually selectable test circuits to perform different types of tests, wherein each of said individually selectable test circuits comprises a device under test, wherein at least two devices under test comprise different types of devices under test, and wherein, for each chip, said testing comprises taking, by said parametric performance monitoring system on said chip, parametric measurements from said at least one of said on-chip parametric measurement macro, said parametric measurements comprising actual measured values for at least one parameter for each device under test and said at least one parameter comprising one of on current (Ion) and threshold voltage (Vt); identifying faulty chips, wherein any chip, having a predetermined number of said parametric measurements that do not meet predetermined pass/fail criteria, is considered faulty; and discarding said faulty chips from said lot. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 34)
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27. A program storage device readable by computer and tangibly embodying a program of instructions executable by said computer to perform a testing method for chips manufactured with on-chip parametric measurement macros, said method comprising:
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testing all chips from a lot after manufacture, wherein each chip comprises a parametric performance monitoring system on said chip, wherein said parametric performance monitoring system comprises at least one on-chip parametric measurement macro comprising a plurality of individually selectable test circuits to perform different types of tests, wherein each of said individually selectable test circuits comprises a device under test, wherein at least two devices under test comprise different types of devices under test, and wherein, for each chip, said testing comprises taking, by said parametric performance monitoring system on said chip, parametric measurements from said at least one of said on-chip parametric measurement macro, said parametric measurements comprising actual measured values for at least one parameter for each device under test and said at least one parameter comprising one of on current (Ion) and threshold voltage (Vt); identifying faulty chips, wherein any chip, having a predetermined number of said parametric measurements that do not meet predetermined pass/fail criteria, is considered faulty; and discarding said faulty chips from said lot. - View Dependent Claims (28, 29, 30, 31, 32, 33)
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Specification