Miniature circuitry and inductive components and methods for manufacturing same

• US 7,656,263 B2
• Filed: 09/18/2008
• Issued: 02/02/2010
• Est. Priority Date: 12/07/2004
• Status: Active Grant

• Current Assignee: Multi-Fineline Electronix Incorporated (Suzhou Dongshan Precision Manufacturing Company Limited)
• Original Assignee: Multi-Fineline Electronix Incorporated (Suzhou Dongshan Precision Manufacturing Company Limited)
• Inventors: Whittaker, Ronald W., Marcoci, Ciprian, Guerra, Joe D.
• Primary Examiner(s): Nguyen; Tuyen
• Application Number:
  US12/233,553
• Publication Number:
  US 20090015364A1
• Time in Patent Office: 502 Days
• Field of Search: 336/65, 336/200, 336/229, 336/232
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 17/062 Toroidal core with turns of coil around it
• CPC Class Codes: H01F 19/04 Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range resonant circuits H03H
• CPC Class Codes: H01F 2017/002 Details of via holes for interconnecting the layers
• CPC Class Codes: H01F 27/266 Fastening or mounting the core on casing or support on coil H01F27/30
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0179 Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/097 Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
• CPC Class Codes: H05K 2201/09809 Coaxial layout reduction of cross-talk, noise or interference by printed shielding conductors for shielding around a single via or around a group of vias H05K1/0222
• CPC Class Codes: H05K 2201/10416 Metallic blocks or heatsinks completely inserted in a PCB metallic supports H05K3/0061
• CPC Class Codes: H05K 3/389 by the use of a coupling agent, e.g. silane
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602

Abstract

Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

Claims

1. A magnetic device comprising:

a support panel;

a magnetic member located in said support panel, wherein said magnetic member comprises a thin foil, and wherein said magnetic member comprises a magnetic core of said magnetic device;

a first through hole in said support panel;

a second through hole in said support panel;

a first plated through hole conductor formed in said first through hole and said second through hole;

a polymer film formed in said first through hole and said second through hole;

a second plated through hole conductor formed in said first through hole and said second through hole, wherein the polymer film electrically insulates said first plated through hole conductor from said second plated through hole conductor, and wherein said first plated through hole conductor and said second plated through hole conductor comprise windings of said magnetic device.

2. The magnetic device of claim 1, wherein said polymer film comprises parylene.

3. The magnetic device of claim 1, wherein said support panel is formed from a printed circuit board.

4. The magnetic device of claim 1 further comprising an opening formed in said support panel, wherein said opening is an opening substantially through said support panel, and wherein said magnetic member is located in said opening.

5. The magnetic device of claim 1 further comprising an opening formed in said support panel, wherein said opening is formed partially through said support panel to leave a seat at the bottom of the opening, and wherein said magnetic member is located in said opening.

6. The magnetic device of claim 1, wherein said magnetic member comprises a substantially toroidal configuration.

7. The magnetic device of claim 1, wherein said magnetic member comprises a substantially rectangular configuration.

8. The magnetic device of claim 1, wherein said magnetic member comprises substantially the shape of an oblong toroid.

9. The magnetic device of claim 1, wherein said magnetic member comprises an asymmetric configuration.

10. The magnetic device of claim 1, wherein said magnetic member comprises a substantially E-shaped configuration.

11. A magnetic device comprising:

a support panel;

a magnetic member located in said support panel, wherein said magnetic member comprises a tape, and wherein said magnetic member comprises a magnetic core of said magnetic device;

a plurality of through holes in said support panel;

a plurality of first plated through hole conductors formed in said through holes,

a polymer film formed in said through holes; and

a plurality of second plated through hole conductors formed in said through holes, wherein the polymer film electrically insulates said first plated through hole conductors from said second plated through hole conductors, and wherein said first plated through hole conductors and said second plated through hole conductors comprise windings of said magnetic device.

12. The magnetic device of claim 11, wherein said polymer film comprises parylene.

13. The magnetic device of claim 11, wherein said support panel is formed from a printed circuit board.

14. The magnetic device of claim 11 further comprising an opening formed in said support panel, wherein said opening is an opening substantially through said support panel, and wherein said magnetic member is located in said opening.

15. The magnetic device of claim 11 further comprising an opening formed in said support panel, wherein said opening is formed partially through said support panel to leave a seat at the bottom of the opening, and wherein said magnetic member is located in said opening.

16. The magnetic device of claim 11, wherein said magnetic member comprises a substantially toroidal configuration.

17. The magnetic device of claim 11, wherein said magnetic member comprises a substantially rectangular configuration.

18. The magnetic device of claim 11, wherein said magnetic member comprises substantially the shape of an oblong toroid.

19. The magnetic device of claim 11, wherein said magnetic member comprises an asymmetric configuration.

20. The magnetic device of claim 11, wherein said magnetic member comprises a substantially E-shaped configuration.