Superhard cutters and associated methods

• US 7,658,666 B2
• Filed: 04/10/2007
• Issued: 02/09/2010
• Est. Priority Date: 08/24/2004
• Status: Active Grant

• Current Assignee: Kinik Company
• Original Assignee: Kinik Company
• Inventors: Sung, Chien-Min
• Primary Examiner(s): RACHUBA, MAURINA T
• Application Number:
  US11/786,426
• Publication Number:
  US 20070249270A1
• Time in Patent Office: 1,036 Days
• Field of Search: 451/527, 451/528, 451/533, 451/544, 451/548, 451/56, 451/443, 451/444, 512/97, 513/00
• US Class Current: 451/56
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: B24B 53/12 Dressing tools; Holders therefor
• CPC Class Codes: B24D 3/14 ceramic, i.e. vitrified bondings

Abstract

A cutting device comprises a plurality of individual polycrystalline cutting elements secured in a solidified organic material layer. Each of the plurality of individual polycrystalline cutting elements has a substantially matching geometric configuration.

Claims

1. A method of forming a cutting device, comprising:

arranging a plurality of individual polycrystalline cutting elements in an uncured organic material, each of the plurality of individual polycrystalline cutting elements having a substantially matching, wedge-shaped geometric configuration and a longitudinal axis extending from a base of the wedge-shaped geometric configuration toward an apex of the wedge-shaped geometric configuration;

orienting at least some of the wedge-shaped cutting elements such that a longitudinal axis of each of the at least some cutting elements is aligned along, and is collinear with, a radius of the cutting device, and a wider portion of each of the at least some cutting elements is disposed nearer an outer perimeter of the cutting device than is a narrower portion of each of the at least some cutting elements; and

curing the organic material to form a solidified organic material layer, such that each of the plurality of individual polycrystalline cutting elements is secured therein.

2. The method of claim 1, further comprising aligning at least one cutting tip of each of the plurality of individual polycrystalline cuffing elements in a common plane.

3. The method of claim 1, wherein each of the individual polycrystalline cutting elements is a divided portion of a polycrystalline blank of material.

4. The method of claim 3, wherein the polycrystalline blank is shaped as a disk, and wherein each of the individual polycrystalline cutting elements is a divided portion of the disk.

5. The method of claim 4, wherein each of the individual polycrystalline cutting elements is an equal portion of the disk.

6. The method of claim 4, wherein the individual polycrystalline cutting elements are radially distributed in the solidified organic material layer.

7. The method of claim 1, wherein the individual polycrystalline cutting elements are of substantially the same size and substantially the same shape.

8. The method of claim 1, where the polycrystalline cutting elements comprise superhard polycrystalline cutting elements.

9. The method of claim 8, wherein the superhard polycrystalline cutting elements comprise superhard polycrystalline particles.

10. The method of claim 8, wherein the superhard polycrystalline cutting elements are selected from the group consisting of:

polycrystalline diamond and polycrystalline cubic boron nitride.

11. A method of forming a cutting device, comprising:

obtaining a disk of polycrystalline superhard material;

dividing the disk into a plurality of cutting elements, each of the cutting elements being a substantially equal portion of the disk and each having a substantially matching wedge-shaped geometric configuration and a longitudinal axis extending from a base of the wedge-shaped geometric configuration toward an apex of the wedge-shaped geometric configuration, the substantially equal portions of the disk collectively providing a surface area substantially the same as a surface area of the disk prior to division of the disk;

radially arranging the plurality of individual polycrystalline cutting elements in an uncured organic material such that the longitudinal axis of each of the individual polycrystalline cutting elements is aligned along and is collinear with a radius of the cutting device; and

curing the organic material to form a solidified organic material layer, such that each of the plurality of individual polycrystalline cutting elements are secured to the cutting device.

12. The method of claim 11, wherein radially arranging the plurality of cutting elements includes arranging at least some of the cutting elements such that a wider portion of each of the at least some cutting elements is disposed nearer an outer perimeter of the cutting device than is a narrower portion of each of the at least some cutting elements.

13. The method of claim 11, further comprising aligning at least one cutting tip of each of the plurality of individual polycrystalline cutting elements in a common plane.

14. The method of claim 11, wherein the individual polycrystalline cutting elements are evenly spaced from one another at a distance of from about 100 microns to about 800 microns.

15. The method of claim 11, wherein the individual polycrystalline cutting elements comprise superhard polycrystalline cutting elements selected from the group consisting of:

polycrystalline diamond and polycrystalline cubic boron nitride.