Test sockets having peltier elements, test equipment including the same and methods of testing semiconductor packages using the same
First Claim
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1. A test socket comprising:
- a socket body in which a semiconductor package is located;
a socket head combined with the socket body to confine the semiconductor package, the socket head including a plurality of openings and a central opening that penetrates a central portion of the socket head;
a Peltier element arranged in the socket head adjacent the semiconductor package; and
power terminals connected to the Peltier element.
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Abstract
A test socket includes a socket body in which a semiconductor package is located, a socket head combined with the socket body, a Peltier element in the socket head, and power terminals connected to the Peltier element. A test equipment includes the test socket and a method of testing the semiconductor package uses the test socket.
22 Citations
12 Claims
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1. A test socket comprising:
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a socket body in which a semiconductor package is located; a socket head combined with the socket body to confine the semiconductor package, the socket head including a plurality of openings and a central opening that penetrates a central portion of the socket head; a Peltier element arranged in the socket head adjacent the semiconductor package; and power terminals connected to the Peltier element. - View Dependent Claims (2, 3, 4)
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5. A method of testing a semiconductor package, the method comprising:
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i) providing a test socket having a socket body, a socket head disposed on the socket body for combination with the socket body, a Peltier element in the socket head, and power terminals connected to the Peltier element, the socket head including a plurality of openings and a central opening that penetrates a central portion of the socket head; ii) inserting a semiconductor package into the socket body so as to be confined therein by the socket head; iii) applying a first voltage to the power terminals to generate heat from the Peltier element, the heat from the Peltier element being conducted to the semiconductor package; iv) operating the semiconductor package; v) testing the semiconductor package; and vi) replacing the semiconductor package that has been tested with a new semiconductor package to be tested. - View Dependent Claims (6, 7, 8)
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9. A test equipment comprising:
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a test unit having a test socket in which a semiconductor package is located; a temperature sensing unit connected to the test unit to indicate a temperature of the semiconductor package; and a control unit connected to the temperature sensing unit to control the test unit, wherein the test socket comprises; a socket body in which the semiconductor package is located; a socket head combined with the socket body so as to confine the semiconductor package, the socket head including a plurality of openings and a central opening that penetrates a central portion of the socket head; a Pettier element arranged in the socket head to be adjacent the semiconductor package; and power terminals connected to the Peltier element. - View Dependent Claims (10, 11, 12)
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Specification