Methods for etching layers within a MEMS device to achieve a tapered edge
First Claim
1. A method of fabricating a MEMS device, comprising:
- forming a sacrificial layer over a substrate;
patterning the sacrificial layer to form apertures;
forming a support layer over the patterned sacrificial layer;
forming a mask over the support layer;
patterning the support layer using the mask to form at least one support structure located at least partially within the aperture in the sacrificial layer; and
tapering the support structure to form a tapered edge, wherein at least a portion of the mask remains in place during the tapering.
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Accused Products
Abstract
Certain MEMS devices include layers patterned to have tapered edges. One method for forming layers having tapered edges includes the use of an etch leading layer. Another method for forming layers having tapered edges includes the deposition of a layer in which the upper portion is etchable at a faster rate than the lower portion. Another method for forming layers having tapered edges includes the use of multiple iterative etches. Another method for forming layers having tapered edges includes the use of a liftoff mask layer having an aperture including a negative angle, such that a layer can be deposited over the liftoff mask layer and the mask layer removed, leaving a structure having tapered edges.
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Citations
19 Claims
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1. A method of fabricating a MEMS device, comprising:
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forming a sacrificial layer over a substrate; patterning the sacrificial layer to form apertures; forming a support layer over the patterned sacrificial layer; forming a mask over the support layer; patterning the support layer using the mask to form at least one support structure located at least partially within the aperture in the sacrificial layer; and tapering the support structure to form a tapered edge, wherein at least a portion of the mask remains in place during the tapering. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification