Case molded capacitor

• US 7,660,099 B2
• Filed: 09/17/2007
• Issued: 02/09/2010
• Est. Priority Date: 09/19/2006
• Status: Active Grant

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Saito, Toshiharu, Nagata, Yoshinari, Miura, Toshihisa, Imamura, Takeshi, Hosokawa, Satoshi
• Primary Examiner(s): THOMAS, ERIC W
• Application Number:
  US11/856,361
• Publication Number:
  US 20080068775A1
• Time in Patent Office: 876 Days
• Field of Search: 361/273, 361/301.2, 361/301.3, 361/301.4, 361/301.5
• US Class Current: 361/301.5
• CPC Class Codes: H01G 2/106 Fixing the capacitor in a housing
• CPC Class Codes: H01G 4/224 Housing; Encapsulation
• CPC Class Codes: H01G 9/008 Terminals
• CPC Class Codes: Y02T 10/70 Energy storage systems for electromobility, e.g. batteries

Abstract

A case molded capacitor has a metallized film capacitor, a pair of bus bars, a resin-made internal case, molding resin, a metal external case, and a buffer material layer. The bus bars are each connected to respective one of electrodes of the metallized film capacitor. The internal case contains the metallized film capacitor. The metallized film capacitor is submerged with molding resin in the internal case so as to expose parts of the bus bars. The external case contains the internal case and both cases are connected at a connecting part. A buffer material layer is put in a gap made at least at a part between the internal case and the external case.

Claims

1. A case molded capacitor comprising:

a metallized film capacitor;

a pair of bus bars each connected to respective one of electrodes of the metallized film capacitor;

a resin-made internal case containing the metallized film capacitor;

molding resin in which the metallized film capacitor is submerged within the internal case so as to expose parts of the bus bars;

a metal external case containing the internal case and being fixed with the internal case at a connecting part; and

a buffer material layer being put in a gap made at least at a part between the internal case and the external case except for the connecting part joining the cases.

2. The case molded capacitor according to claim 1,

wherein the buffer material layer is made of urethane.

3. The case molded capacitor according to claim 1,

wherein the internal case is made of polyphenylene sulfide.

4. The case molded capacitor according to claim 1,

wherein the external case is made of aluminum.