×

Case molded capacitor

  • US 7,660,099 B2
  • Filed: 09/17/2007
  • Issued: 02/09/2010
  • Est. Priority Date: 09/19/2006
  • Status: Active Grant
First Claim
Patent Images

1. A case molded capacitor comprising:

  • a metallized film capacitor;

    a pair of bus bars each connected to respective one of electrodes of the metallized film capacitor;

    a resin-made internal case containing the metallized film capacitor;

    molding resin in which the metallized film capacitor is submerged within the internal case so as to expose parts of the bus bars;

    a metal external case containing the internal case and being fixed with the internal case at a connecting part; and

    a buffer material layer being put in a gap made at least at a part between the internal case and the external case except for the connecting part joining the cases.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×