OLED patterning method

• US 7,662,663 B2
• Filed: 03/28/2007
• Issued: 02/16/2010
• Est. Priority Date: 03/28/2007
• Status: Active Grant

• Current Assignee: Global OLED Technology LLC (LG Display Co., Ltd.)
• Original Assignee: Eastman Kodak Company
• Inventors: Cok, Ronald S., Rider, Christopher B.
• Primary Examiner(s): Garber; Charles D
• Assistant Examiner(s): SENE, PAPE A
• Application Number:
  US11/692,381
• Publication Number:
  US 20080241989A1
• Time in Patent Office: 1,056 Days
• Field of Search: 438/106, 438/99, 427/555
• US Class Current: 438/106
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/221 by lift-off techniques

Abstract

A method of patterning a substrate according to several steps, including: a) mechanically locating a first masking film over the substrate; and b) segmenting the first masking film into a first masking portion and one or more first opening portions in first locations. Next, mechanically locate a first removal film over the first masking portion and first opening portions. Afterwards, one or more of the first opening portions are adhered to the first removal film. The first removal film and one or more of the first opening portions adhered to the first removal film are mechanically removed to form one or more first openings in the first masking film. Finally, materials are deposited over the substrate through the first openings in the first masking film.

Claims

1. A method of patterning a substrate, comprising the sequential steps of:

a) providing a pre-formed first masking film and a pre-formed first removal film;

b) physically locating the pre-formed first masking film over the substrate;

c) segmenting the located pre-formed first masking film into a first masking portion and one or more first opening portions in first locations and physically locating the pre-formed first removal film over the first masking portion and first opening portions;

d) adhering one or more of the first opening portions to the located pre-formed first removal film;

e) picking up and removing the located pre-formed first removal film and one or more of the first opening portions adhered to the located pre-formed first removal film to form one or more first openings in the located pre-formed first masking film; and

f) depositing first materials over the substrate through the first openings in the located pre-formed first masking film;

g) providing a pre-formed second masking film and then physically locating the pre-formed second masking film over the located pre-formed first masking film and first openings, wherein the pre-formed second masking film is not formed inside the first openings;

h) segmenting the located pre-formed second masking film into a second masking portion and one or more second opening portions in second locations and physically locating a pre-formed second removal film over the second masking portion and second opening portions;

i) adhering one or more of the second opening portions to the located pre-formed second removal film;

j) picking up and removing the located pre-formed second removal film and one or more of the second opening portions adhered to the located pre-formed second removal film to form one or more second openings in the located pre-formed second masking film; and

k) depositing second materials over the substrate through the second openings in the located pre-formed second masking film;

l) picking up and removing the first masking portion and second masking portion.

2. The method of claim 1, further comprising the steps of picking un and removing the located pre-formed first masking film after the second materials are deposited.

3. The method of claim 1, wherein at least some of the first locations we different from the second locations.

4. The method of claim 1, wherein the materials we light-emissive materials.

5. The method of claim 1, wherein a pattern-wise controllable adhesive layer is formed on either the pre-formed first masking film or the pre-formed first removal film.

6. The method of claim 1, wherein one of the first opening portions covers a plurality of distinct, non-contiguous, light-emitting areas located over the substrate.

7. The method of claim 6, further comprising the step of segmenting the located pre-formed first masking film in the areas between the light-emitting areas.

8. The method of claim 6, further comprising the step of forming raised areas between the light-emitting areas before the pre-formed first masking film is located over the substrate.

9. The method of claim 1, wherein both the pre-formed first masking film and the pre-formed first removal film are physically located over the substrate together at the same time.

10. The method of claim 1, wherein both the located pre-formed first masking film and the located pre-formed first removal film are segmented at the same time.

11. The method of claim 10, further comprising the step of reattaching the segmented portions of the located pre-formed first removal film.

12. The method of claim 10, further comprising the step of adhering a pre-formed second removal film to the located pre-formed first removal film and picking up and removing the pre-formed second removal film, the located pre-formed first removal film, and the first opening portions at the same time.

13. The method of claim 1, wherein the side of the pre-formed first removal film opposite the substrate is adhesive.

14. The method of claim 1, wherein the pre-formed first removal film is transparent.

15. The method of claim 14, wherein the located pre-formed first masking film is segmented by exposure to laser light through the transparent located pre-formed first removal film.

16. The method of claim 5, wherein the pattern-wise controllable adhesive layer is controlled by exposure to a first frequency of light and the pre-formed first masking film is segmented by exposure to a second frequency of light.