Circuit board with improved ground plane

• US 7,663,063 B2
• Filed: 04/19/2007
• Issued: 02/16/2010
• Est. Priority Date: 12/22/2006
• Status: Active Grant

• Current Assignee: Gold Charm Limited (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: Lin, Yu-Hsu, CHAO, CHIH-HANG, Wu, Jeng-Da
• Primary Examiner(s): Patel, Ishwarbhai B
• Application Number:
  US11/737,147
• Publication Number:
  US 20080151521A1
• Time in Patent Office: 1,034 Days
• Field of Search: 174/254, 174/255, 174/260
• US Class Current: 174/255
• CPC Class Codes: H05K 1/0224 Patterned shielding planes, ground planes or power planes H05K1/0253 takes precedence
• CPC Class Codes: H05K 1/0253 Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings H05K1/0251 takes precedence
• CPC Class Codes: H05K 2201/09681 Mesh conductors, e.g. as a ground plane

Abstract

A circuit board is provided for improving signal quality, including a signal plane for a plurality of signal traces arranged thereon and a ground plane formed by a plurality of tiles connected to each other in an array. Each tile is formed by ground traces. Different line segments of a signal trace mapped on the ground plane cross ground traces of the tiles at similar angles, thereby minimizing interaction between the ground traces and the signal traces to reduce differences in impedances of the signal traces.

Claims

1. A circuit board, comprising:

a signal plane for a plurality of signal traces arranged thereon, each of the signal traces comprising a plurality of straight line segments, each line segment extending along a path different from the others; and

a ground plane comprising a plurality of equilateral polygon shaped tiles having the same shape and connected to each other in an array, each tile formed by ground traces, all of the line segments of each signal trace mapped on the ground plane arranged at about 22.5 degrees relative to any given ground trace of the tiles, thereby minimizing interaction between the ground traces and the signal traces to reduce differences in impedances of the signal traces.

2. The circuit board as described in claim 1, wherein each tile is formed by a plurality of curved ground traces connected consecutively end-to-end.

3. The circuit board as described in claim 2, wherein each tile is generally triangle-shaped and has convex corners and concave sides.

4. The circuit board as described in claim 2, wherein each tile is generally square-shaped and has wavy sides.

5. The circuit board as described in claim 2, wherein each tile is generally triangle-shaped and has wavy sides.

6. The circuit board as described in claim 1, wherein the line segments each signal trace are arranged at about 0 degree, 30 degrees, 45 degrees, 60 degrees or 90 degrees relative to one of the two adjacent sides of the circuit board.

7. The circuit board as described in claim 6, wherein each tile is equilateral triangle shaped, square shaped or equilateral hexagon shaped.