Substrate damage detection mechanism using RFID tag

• US 7,663,491 B2
• Filed: 08/30/2006
• Issued: 02/16/2010
• Est. Priority Date: 08/30/2006
• Status: Expired due to Fees

• Current Assignee: Chung Hua University
• Original Assignee: Chung Hua University
• Inventors: Wu, Chia-Wen, Wang, Chih-Hu, Yen, Ming-Ching, Tien, Ching-Cheng, Chen, Jwu-E, Lee, Bore-Kuen, Hwang, Chi-Kuang, Chung, In-Hang, Chiu, Chien-Jung, Chen, Tung-Chou
• Primary Examiner(s): Wu; Daniel
• Assistant Examiner(s): Rushing; Mark
• Application Number:
  US11/512,281
• Publication Number:
  US 20080061972A1
• Time in Patent Office: 1,266 Days
• Field of Search: 340/10.41, 340/426.27, 340/572.8, 340/572.7, 340/571, 340/572.9, 340/568.2, 340/545.1, 343/711, 343/712, 343/713, 701/29, 701/54
• US Class Current: 340/572.7
• CPC Class Codes: G06K 19/07381 with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering

Abstract

Disclosed is a substrate damage detection mechanism using Radio Frequency Identification (RFID) tag including a substrate, at least one RFID tag with a RFID chip, a RFID transmitter and at least one data input/output port and at least one conducting circuit loop arranged to cover the substrate and provided with a first end that is electrically connected to a reference voltage and a second end that is electrically connected to the data input/output port of the RFID tag. The RFID chip generates a conductive code when the conducting circuit loop is originally conducting and generates a open-circuit code when the conducting circuit loop becomes open circuit resulting from the damage of the substrate in which both the conductive code and the open-circuit code are transmitted by the RFID transmitter and received by a RFID reader to determine the damage of the substrate.

Claims

1. A substrate damage detection mechanism using RFID tags, comprising:

a substrate made of glass material;

at least one RFID tag with a RFID chip, a RFID transmitter and at least one data input/output port; and

a defogging circuit arranged to cover the substrate and provided with a first end that is electrically connected to a ground potential and a second end that is electrically connected to the data input/output port of the RFID tag and a potential with a predetermined direct current;

wherein the RFID chip generates a conductive code when the defogging circuit is originally conducting and generates an open-circuit code when the defogging circuit becomes open circuit resulting from the damage of the substrate in which both the conductive code and the open-circuit code are transmitted by the RFID transmitter and received by a RFID reader to determine the damage of the substrate.

2. The mechanism as claimed in claim 1, wherein the substrate is a windshield of an automobile.

3. The mechanism as claimed in claim 1, wherein the defogging circuit is transparent conducting glue.

4. The mechanism as claimed in claim 1, wherein the defogging circuit is arranged to cover the surface of the substrate.

5. The mechanism as claimed in claim 1, wherein the defogging circuit is arranged to cover the margin of the substrate.

6. The mechanism as claimed in claim 1, further comprises a protecting circuit arranged between the second end of the defogging circuit and the data input/output port of the RFID tag.

7. The mechanism as claimed in claim 6, wherein the protecting circuit comprises at least one diode with a positive pole connected to the data input/output port of the RFID tag and a negative pole connected to the second end of the defogging circuit.

8. The mechanism as claimed in claim 6, wherein the protecting circuit further comprises a voltage regulator.

9. The mechanism as claimed in claim 8, wherein the voltage regulator comprises a zener diode.