Heat transfer mechanism, heat dissipation system, and communication apparatus

• US 7,663,883 B2
• Filed: 06/18/2004
• Issued: 02/16/2010
• Est. Priority Date: 02/13/2004
• Status: Expired due to Fees

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Ueda, Satoshi, Yamazaki, Naoya, Iino, Kazuhiro, Tada, Yoshiaki, Shirakami, Takashi
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US10/871,675
• Publication Number:
  US 20050180113A1
• Time in Patent Office: 2,069 Days
• Field of Search: 361699-704, 165 804- 805, 165/104.33, 165/185, 174/15.2
• US Class Current: 361/700
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28F 13/00 Arrangements for modifying heat-transfer, e.g. increasing, decreasing F28F1/00 - F28F11/00 take precedence
• CPC Class Codes: F28F 2013/005 Thermal joints
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/373 Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons

Abstract

A heat transfer mechanism for dissipating heat from a heat generating body to a heat dissipating part, realizing both a high elasticity and a high thermal conductivity, comprised of a film-shaped heat conductor for transferring heat to the heat dissipating part and an elastic member for imparting elasticity to the film-shaped heat conductor, the film-shaped heat conductor being formed from metal foil-type flexible heat pipes or carbon-based thermal conductive sheets.

Claims

1. A heat transfer mechanism for dissipating heat from a heat generating body to a heat dissipating part, the heat generating body being directly coupled, at its bottom surface, to a common board, comprising:

a film-shaped heat conductor for transferring heat from a top surface of the heat generating body to the heat dissipating part; and

an elastic member directly coupled, at its upper surface, with said heat dissipating part and, at its lower surface, with said film-shaped heat conductor, the length of the elastic member being shorter than the length of the top surface of said heat generating body, for imparting elasticity to the film-shaped heat conductor,

said film-shaped heat conductor being formed from a metal foil-type flexible heat pipe,

wherein said film-shaped heat conductor has a double bent shape of an upper leg and a lower leg arranged in parallel with each other and connected by a middle leg that offsets the upper and lower legs with obtuse angles and transfers heat from the top surface of the heat generating body to the heat dissipating part along the double bent heat conductor by sandwiching the lower leg of said double bent heat conductor between said heat generating body and said elastic member so that said lower leg of said double bent heat conductor makes direct contact with substantially an entire top surface of said heat generating body, and coupling the upper leg of said double bent heat conductor directly to said heat dissipating part by extending said upper leg of said double bent heat conductor beyond an end portion of said heat generating body.

2. The heat transfer mechanism as set forth in claim 1 wherein said elastic member is comprised of a polymer-based member.

3. The heat transfer mechanism as set forth in claim 1 wherein bonding members are used for interconnecting said heat generating body, said film-shaped heat conductor, said elastic member, and said heat dissipating part.

4. The heat transfer mechanism as set forth in claim 1, further provided with tight fixing means for clamping said heat generating body, said film-shaped heat conductor, and said elastic member between a board mounting said heat generating body and a heat diffusion plate forming said heat dissipating part.

5. A heat dissipation system dissipating heat generated from heat generating bodies mounted, at their bottom surfaces, on a common board through a heat transfer mechanism to a common heat dissipating part, wherein:

said heat transfer mechanism comprises, for each heat generating body, a film-shaped heat conductor transferring heat from a top surface of a heat generating body to said heat dissipating part and an elastic member directly coupled with said heat dissipating part, the length of the elastic member being shorter than the length of the surface of said heat generating body, for imparting elasticity to said film-shaped heat conductor,

said film-shaped heat conductor is formed from a metal foil-type flexible heat pipe, and

said film-shaped heat conductor has a double bent shape of an upper leg and a lower leg arranged in parallel with each other and connected by a middle leg that offsets the upper and lower legs with obtuse angles and transfers heat from the top surface of the heat generating body to the heat dissipating part along the double bent heat conductor by sandwiching the lower leg of said double bent heat conductor between said heat generating body and said elastic member so that said lower leg of said double bent heat conductor makes direct contact with substantially an entire top surface of said heat generating body, and coupling directly the upper leg of said double bent heat conductor to said heat dissipating part, by extending said upper leg of said double bent heat conductor beyond an end portion of said heat generating body.

6. A communication apparatus provided with heat generating bodies constituted by IC packages and with a heat dissipation system as set forth in claim 5 for dissipating heat from said heat generating bodies.