Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier plane

• US 7,665,999 B2
• Filed: 11/14/2008
• Issued: 02/23/2010
• Est. Priority Date: 09/08/2005
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Coteus, Paul W., Colgan, Evan G., Beaman, Brian S., Hougham, Gareth G., Oggioni, Stefano S., Vargas, Enrique
• Primary Examiner(s): Prasad; Chandrika
• Application Number:
  US12/270,956
• Publication Number:
  US 20090070999A1
• Time in Patent Office: 466 Days
• Field of Search: 439/66, 439/74, 439/86, 439/91, 439/178, 439/591
• US Class Current: 439/66
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01R 12/52 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H01R 12/714 with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer elastomeric conductor H05K2201/0314
• CPC Class Codes: H05K 2201/0367 Metallic bump or raised conductor not used as solder bump solder materials or compositions and methods of application thereof H05K3/3457
• CPC Class Codes: H05K 2201/09481 Via in pad; Pad over filled via if used for surface mounting H05K1/113
• CPC Class Codes: H05K 2201/09745 Recess in conductor, e.g. in pad or in metallic substrate
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/4007 Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: H05K 7/1061 co-operating by abutting
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49147 : Assembling terminal to base
• CPC Class Codes: Y10T 29/49149 : by metal fusion bonding
• CPC Class Codes: Y10T 29/49151 : by deforming or shaping
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49158 : with molding of insulated base
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49204 : Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49208 : by assembling plural parts
• CPC Class Codes: Y10T 29/49213 : Metal
• CPC Class Codes: Y10T 29/49218 : with deforming
• CPC Class Codes: Y10T 29/49222 : forming array of contacts or terminals

Abstract

A module arrangement which includes a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a moldable dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

Claims

1. A land grid array (LGA) interposer structure, comprising an electrically insulating carrier plane, at least one interposer mounted on a first surface of said carrier plane, said at least one interposer selectively having a hemi-toroidal, conical, dome-shaped conic section, generally cylindrical or hemi-spherical configuration in transverse cross-section and being constituted of a dielectric elastomeric material consisting of moldable polymer having rubber-like resilient characteristics:

a plurality of electrically-conductive elements arranged about the surface of said at least one hemi-toroidal interposer that extend radially inwardly and downwardly from an uppermost end thereof for electrical communication with at least one component located on an opposite side of said electrically insulating carrier plane, said electrically-insulating carrier plane having at least one through-extending via formed therein;

providing an electrically-conductive pad to extend through said at least one via and having portions extending in surface contact with upper and lower surfaces of said insulating carrier plane, said electrically-conductive elements comprising metallic strips extending into electrical contact with the pad portion on the upper surface of said pad, at least one component being located on the opposite side of said insulating carrier plane in electrical contact with the pad portion on the lower surface of said pad and in electrically-conductive communication with said plurality of electrically-conductive elements, said at least one via extending through said insulating carrier plane being axially offset on said insulating plane relative said at least one hemi-toroidal interposer, and including anchoring holes that extend through said insulating carrier plane communicating with said at least one interposer and receiving a molding material for anchoring said at least one interposer to said insulating carrier plane.

2. An interposer structure as claimed in claim 1, wherein the at least one component in contact with said pad portion which extends in contact with the lower surface of said insulating carrier plane comprises a solder ball.

3. An interposer structure as claimed in claim 1, wherein said polymer is selected from the group of materials consisting of silicon rubber, siloxane, PDMS, polyurethane, polybutadiene and copolymers thereof, polystyrene and copolymers thereof, acrylonitrile and copolymers thereof, and epoxides and copolymers thereof.