×

Paper including semiconductor device and manufacturing method thereof

  • US 7,667,310 B2
  • Filed: 06/25/2007
  • Issued: 02/23/2010
  • Est. Priority Date: 06/26/2006
  • Status: Active Grant
First Claim
Patent Images

1. A paper including a semiconductor device, the semiconductor device comprising:

  • a flexible base; and

    a stacked-layer body over the flexible base, the stacked-layer body comprising an element layer having a circuit including a thin film transistor and an antenna electrically connected to the circuit, and a sealing layer for sealing a top surface of the element layer,wherein a thickness of the semiconductor device is less than or equal to 30 μ

    m.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×