Method and device for providing electronic circuitry on a backplate
First Claim
Patent Images
1. A display, comprising:
- a transparent substrate;
an array of interferometric modulators comprising reflective elements that are configured to reflect light through said transparent substrate;
a backplane comprising a first surface proximal to the array of interferometric modulators and comprising an application-specific integrated circuit (ASIC) fabricated on said first surface of the backplane, wherein the ASIC comprises driver circuitry configured to control the movement of the reflective elements, the ASIC comprising a silicon layer, wherein the backplane is attached to the transparent substrate via a seal to form a cavity between the transparent substrate and the backplane, and wherein said cavity comprises an empty space between at least a portion of the array of interferometric modulators and the backplane; and
a plurality of electrical connections providing electronic communication between the ASIC on the backplane and the array of interferometric modulators.
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Abstract
A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate may contain electronic circuitry fabricated on the backplane. The electronic circuitry is placed in electrical communication with the array of interferometric modulators and is configured to control the state of the array of interferometric modulators.
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Citations
24 Claims
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1. A display, comprising:
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a transparent substrate; an array of interferometric modulators comprising reflective elements that are configured to reflect light through said transparent substrate; a backplane comprising a first surface proximal to the array of interferometric modulators and comprising an application-specific integrated circuit (ASIC) fabricated on said first surface of the backplane, wherein the ASIC comprises driver circuitry configured to control the movement of the reflective elements, the ASIC comprising a silicon layer, wherein the backplane is attached to the transparent substrate via a seal to form a cavity between the transparent substrate and the backplane, and wherein said cavity comprises an empty space between at least a portion of the array of interferometric modulators and the backplane; and a plurality of electrical connections providing electronic communication between the ASIC on the backplane and the array of interferometric modulators. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 21, 23)
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10. A device comprising an interferometric modulator-based display, said display comprising:
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a transparent substrate, said transparent substrate comprising a first substrate surface; an array of interferometric modulators comprising reflective elements that are configured to reflect light through said transparent substrate; a backplane comprising a first surface proximal to the array of interferometric modulators, wherein said first surface of the backplane supports an application-specific integrated circuit (ASIC) configured to control the movement of the reflective elements wherein the backplane is attached to the transparent substrate via a seal to form a cavity between the transparent substrate and the backplane, and wherein said cavity comprises an empty space between at least a portion of the array of interferometric modulators and the backplane; and a plurality of conductive support posts extending upwards from the array of interferometric modulators and contacting a first conductive material supported by the backplate and in electronic communication with the ASIC to provide electronic communication between the ASIC on the backplane and the array of interferometric modulators. - View Dependent Claims (18, 19, 20, 22)
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11. A display, comprising:
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a transparent substrate, said transparent substrate comprising a first substrate surface; an array of interferometric modulators comprising reflective elements that are configured to reflect light through said transparent substrate; a backplane comprising a first surface proximal to the array of interferometric modulators, wherein said first surface of the backplane supports an application-specific integrated circuit (ASIC) configured to control the movement of the reflective elements, the ASIC comprising a silicon layer, wherein the backplane is attached to the transparent substrate via a seal to form a cavity between the transparent substrate and the backplane, and wherein said cavity comprises an empty space between at least a portion of the array of interferometric modulators and the backplane; and means for providing electronic communication between the ASIC on the backplane and the array of interferometric modulators. - View Dependent Claims (12, 13, 14, 15, 16, 17, 24)
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Specification