Method and apparatus for randomizing dispatch order for single wafer processing

• US 7,668,615 B2
• Filed: 10/02/2007
• Issued: 02/23/2010
• Est. Priority Date: 10/02/2007
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: GlobalFoundries, Inc.
• Inventors: Marshall, Leslie, Goff, Gerald L., Likes, Donald C.
• Primary Examiner(s): Patel; Ramesh B
• Application Number:
  US11/866,060
• Publication Number:
  US 20090088882A1
• Time in Patent Office: 875 Days
• Field of Search: 700 99-101, 700108-110, 700/112, 700114-115, 700/218, 700/222, 700/228, 414/217
• US Class Current: 700/101
• CPC Class Codes: G05B 19/41865 characterised by job scheduling, process planning, material flow
• CPC Class Codes: G05B 2219/32269 Decision, of job release, select job to be launched next in shop
• CPC Class Codes: G05B 2219/32271 Decision of job dispatching, select job to process next on each machine
• CPC Class Codes: G05B 2219/32324 Quality data determines optimum machine sequence selection, queuing rules
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A method for dispatching wafers for processing in a tool includes identifying a queue of wafers available to be processed in the tool. One of the wafers is randomly selected based at least in part on a length of time each wafer has been in the queue. The selected wafer is dispatched for processing in the tool.

Claims

1. A method for dispatching wafers for processing in a tool, comprising:

identifying a queue of wafers available to be processed in the tool;

randomly selecting one of the wafers based at least in part on a length of time each wafer has been in the queue; and

dispatching the selected wafer for processing in the tool.

2. The method of claim 1, further comprising:

generating a weight factor for each wafer in at least a subset of the wafers, the weight factor including a first component determined based on the length of time the associated wafer has been in the queue; and

randomly selecting one of the wafers from the subset based on the weight factors.

3. The method of claim 2, wherein generating the weight factor comprises generating a second component based on a relative priority of the associated wafer.

4. The method of claim 3, further comprising adding the first and second components to generate the weight factor.

5. The method of claim 3, further comprising multiplying the first and second components to generate the weight factor.

6. The method of claim 1, further comprising:

selecting a subset of wafers in a queue of wafers available to be processed in the tool based on the length of time each wafer has been in the queue; and

randomly selecting one of the wafers in the subset for dispatching to the tool.

7. The method of claim 6, further comprising:

updating the selected subset after dispatching the selected wafer; and

randomly selecting a subsequent wafer from the updated subset.

8. The method of claim 6, wherein selecting the subset further comprises:

defining a window based on a time interval; and

adding wafers that entered the queue within the window to the subset.

9. A manufacturing system, comprising:

a tool operable to process wafers;

a workflow unit operable to identify a queue of wafers available to be processed in the tool, randomly select one of the wafers based at least in part on a length of time each wafer has been in the queue, and dispatch the selected wafer for processing in the tool.

10. The system of claim 9, wherein the workflow unit is further operable to further generate a weight factor for each wafer in at least a subset of the wafers, the weight factor including a first component determined based on the length of time the associated wafer has been in the queue, and randomly select one of the wafers from the subset based on the weight factors.

11. The system of claim 10, wherein the workflow unit is further operable to generate a second component of the weight factor based on a relative priority of the associated wafer.

12. The system of claim 11, wherein the workflow unit is further operable to add the first and second components to generate the weight factor.

13. The system of claim 11, wherein the workflow unit is further operable to multiply the first and second components to generate the weight factor.

14. The system of claim 9, wherein the workflow unit is further operable to select a subset of wafers in a queue of wafers available to be processed in the tool based on the length of time each wafer has been in the queue and randomly select one of the wafers in the subset.

15. The system of claim 14, wherein the workflow unit is further operable to update the selected subset after dispatching the selected wafer and randomly select a subsequent wafer from the updated subset for dispatching to the tool.

16. The system of claim 14, wherein the workflow unit is further operable to define a window based on a time interval and add wafers that entered the queue within the window to the subset.

17. A system, comprising:

means for identifying a queue of wafers available to be processed in a tool;

means for randomly selecting one of the wafers based at least in part on a length of time each wafer has been in the queue; and

means for dispatching the selected wafer for processing in the tool.