High-speed RFID circuit placement method

• US 7,669,318 B2
• Filed: 10/31/2007
• Issued: 03/02/2010
• Est. Priority Date: 09/22/2004
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Corporation
• Inventors: Munn, Jason
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US11/931,478
• Publication Number:
  US 20080061981A1
• Time in Patent Office: 853 Days
• Field of Search: 296/00, 296/012, 296/06, 295/912, 29825-834, 298/46, 298/47, 156248-255, 156/261, 156/264, 156/299, 156/302, 343/872, 343/873, 340/572.1, 340/572.4, 257/679, 257/712, 359678-679
• US Class Current: 29/832
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/49137 Different components
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53191 Means to apply vacuum directly to position or hold work part

Abstract

A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum transfers chips or interposers to a moving web of electrical components by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web. According to another method, a primary drum removes chips or interposers from a carrier web having a first pitch, and transfers the chips or interposers to a variably rotating secondary drum which then places the chips or interposers onto an electrical component on a moving web having a second pitch.

Claims

1. A method of placing an RFID circuit onto an electrical component the method comprising:

securing an RFID circuit to a primary drum;

transferring the RFID circuit from the primary drum to a secondary drum; and

placing the RFID circuit from the secondary drum onto an electrical component on a moving web;

wherein the transferring includes adjusting the peripheral speed of at least one of the primary and secondary drums such that the peripheral speed of the each drum is substantially equal;

wherein the placing includes adjusting the peripheral speed of the secondary drum such that the peripheral speed of the secondary drum is substantially equal to the speed of the moving web; and

wherein at least one of the transferring and the placing includes increasing the peripheral speed of at least one of the primary and secondary drums such that velocity of the RFID circuit is increased from a relatively low peripheral speed during the securing to a relatively high peripheral speed during the placing.

2. The method of claim 1, wherein the transferring frirther includes selective application of a vacuum source operatively coupled to at least one primary nozzle on a circumferential surface of the primary drum and at least one secondary nozzle on a circumferential surface of the secondary drum.

3. The method of claim 2, wherein the placing includes selective application of a vacuum source operatively coupled to the secondary nozzles.

4. The method of claim 2, wherein the transferring includes aligning the axes of a primary nozzle and a secondary nozzle.

5. The method of claim 1, wherein the RFID circuit comprises an RFID interposer that includes interposer leads mounted to the RFID circuit.

6. The method of claim 1, wherein the primary drum is stationary during the securing step.

7. The method of claim 1, wherein the primary drum includes a plurality of recesses around the circumferential surface for receiving the RFID circuits.

8. The method of claim 1, wherein the primary drum includes a vacuum source for temporarily securing the RFID circuit to the primary drum.

9. The method of claim 1, wherein the secondary drum includes at least one nozzle.

10. The method of claim 1, wherein the secondary drum includes three secondary nozzles disposed at 120 degree intervals around the circumferential surface of the secondary drum.

11. The method of claim 1, wherein the primary drum and secondary drum rotate in opposite directions in a common plane.

12. A method of placing an RFID circuit onto an electrical component, the method comprising:

securing an RFID circuit to a primary rotary placement device;

transferring the RFID circuit from the primary rotary placement device to a secondary rotary placement device; and

placing the RFID circuit from the secondary rotary placement device onto an electrical component on a moving web;

wherein the transferring includes adjusting the peripheral speed of at least one of the primary and secondary rotary placement devices such that the peripheral speed of the each rotary placement device is substantially equal;

wherein the placing includes adjusting the peripheral speed of the secondary rotary placement device such that the peripheral speed of the secondary rotary placement device is substantially equal to the speed of the moving web; and

wherein at least one of the transferring and the placing includes increasing the peripheral speed of at least one of the primary and secondary rotary placement devices such that velocity of the RFID circuit is increased from a relatively low peripheral speed during the securing to a relatively high peripheral speed during the placing.