Conductive layer, manufacturing method of the same, and signal transmission substrate

• US 7,670,144 B2
• Filed: 11/27/2006
• Issued: 03/02/2010
• Est. Priority Date: 11/28/2005
• Status: Expired due to Fees

• Current Assignee: Hoya Corporation
• Original Assignee: Hoya Corporation
• Inventors: Matsumoto, Mitsuhiro, Ito, Eiichi, Tsuda, Koji, Minakuchi, Tadashi
• Primary Examiner(s): Nguyen; Ha T.
• Assistant Examiner(s): Kusumakar; Karen M
• Application Number:
  US11/563,311
• Publication Number:
  US 20070120219A1
• Time in Patent Office: 1,191 Days
• Field of Search: 338/210, 338/211, 338/214, 307125-131, 11247501-47526
• US Class Current: 439/37
• CPC Class Codes: H05K 1/0287 having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/09263 Meander
• CPC Class Codes: H05K 2201/09609 Via grid, i.e. two-dimensional array of vias or holes in a single plane interposers H05K2201/10378
• CPC Class Codes: H05K 2201/10287 Metal wires as connectors or conductors
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 3/103 by bonding or embedding conductive wires or strips

Abstract

There is provided a method of manufacturing a conductive layer of in a signal transmission substrate. The method includes sewing conductive thread in sheet-like material having an insulating property so as to form one of a plurality of low resistance regions using the conductive thread in a high resistance region formed by the sheet-like material, moving the conductive thread from an end point of a previously sewed low resistance region to a start point of a low resistance region to be sewed subsequently, repeating the sewing and moving steps to form the plurality of low resistance regions in the high resistance region, and forming a plurality of holes in the conductive layer by press working so that an electrical component attached to at least one of the plurality of holes is able to transmit a signal between neighboring ones of the plurality of low resistance regions.

Claims

1. A method of manufacturing a conductive layer to be included in a signal transmission substrate for transmitting a signal in accordance with a two-dimensional diffusive signal-transmission technology, the conductive layer having a plurality of low resistance regions and a high resistance region to insulate neighboring ones of the plurality of low resistance regions from each other, the method comprising:

sewing conductive thread in sheet-like material having an insulating property so as to form one of the plurality of low resistance regions using the conductive thread in the high resistance region formed by the sheet-like material;

moving the conductive thread from an end point of sewing of a previously sewed low resistance region to a start point of sewing of a low resistance region to be sewed subsequently;

repeating the sewing and moving to form the plurality of low resistance regions in the high resistance region; and

forming a plurality of holes in the conductive layer by press working so that an electrical component attached to at least one of the plurality of holes is able to transmit a signal between neighboring ones of the plurality of low resistance regions.

2. The method according to claim 1,

wherein the conductive thread interconnecting the start point and the end point of neighboring low resistance regions is also cut by forming the plurality of holes by the press working.

3. The method according to claim 1,

wherein the sheet-like material includes fabric.

4. The method according to claim 1,

wherein the electrical component includes a communication chip.

5. A signal transmission substrate for transmitting a signal in accordance with a two-dimensional diffusive signal-transmission technology, comprising:

at least one insulating layer;

a conductive layer through which the signal is transmitted; and

at least one through hole part formed in the signal transmission substrate,

wherein the at least one through hole part includes;

a plurality of through holes respectively formed in a plurality of layers including the at least one insulating layer and the conductive layer forming the signal transmission substrate; and

a step-like structure formed by a difference between diameters of at least two of the plurality of through holes,

wherein the conductive layer includes;

a plurality of low resistance regions; and

a high resistance region serving to insulate the plurality of low resistance regions from each other,

wherein each of the plurality of low resistance regions is formed by conductive thread.

6. The signal transmission substrate according to claim 5, wherein:

the conductive layer further includes a plurality of holes arranged in a matrix located such that each of the plurality of holes contacts at least two neighboring ones of the plurality of low resistance regions; and

the plurality of holes serve to respectively catch electrical components.

7. The signal transmission substrate according to claim 6,

wherein at least parts of the electrical components are communication chips transmitting a signal in accordance with the two-dimensional diffusive signal-transmission technology.

8. The signal transmission substrate according to claim 7,

wherein the other parts of the electrical components are short-circuit members.

9. The signal transmission substrate according to claim 5,

wherein the plurality of through holes are aligned concentrically about a center axis of the through hole part.

10. The signal transmission substrate according to claim 5,

wherein diameters of at least parts of the plurality of through holes gradually increase toward a top side of the signal transmission substrate.

11. The signal transmission substrate according to claim 10,

wherein a bottom one of the plurality of through holes has a diameter larger than a diameter of an adjacent through hole of the plurality of through holes.

12. The signal transmission substrate according to claim 5,

wherein the plurality of layers include seven layers of an insulating layer, a ground layer, an insulating layer, the conductive layer, an insulating layer, a power layer, and an insulating layer laminated in this order from a bottom side of the signal transmission substrate.