Method of manufacturing ceramic LED packages
First Claim
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1. A method for forming an LED package from a panel, the method comprising:
- forming a top body layer of the panel;
forming an intermediate body layer of the panel;
forming a cavity through a portion of the top body layer and the intermediate body layer corresponding to the center of the LED package;
forming a thermally conducting ceramic layer of the panel, the thermally conducting ceramic layer having a top surface and a bottom surface;
bonding a metallization pattern including a thermal bonding pad to the top surface of the thermally conducting ceramic layer, the thermal bonding pad configured to thermally bond the top surface of the conducting ceramic layer to an LED;
bonding a substantially continuous central pad without a corner on the bottom surface of the thermally conducting ceramic layer, the central pad having a continuously curved periphery and configured to provide a thermal path from the bottom surface of the thermally conducting ceramic layer to a substrate;
bonding the intermediate body layer between the top body layer and thermally conducting ceramic layer such that the panel includes the top layer, the intermediate body layer, and the thermally conducting ceramic layer;
creating a grid of LED packages in the panel, the grid defined by one or more grooves on a top surface and a bottom surface of the panel; and
separating the LED package from the grid of LED packages in the panel by breaking the panel along the one or more grooves of the grid.
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Abstract
Methods of forming LED packages and light emitting devices are provided. LED packages and light emitting devices are preferably formed from ceramic layers, such as AlN, though layers of non-ceramic materials can also be used. The layers are formed to include vias, apertures, and metallization layers. The layers are then bonded together to form a panel. The panel is scribed to form a grid of snap lines and then the panel is fractured along the snap lines. To form light emitting devices from the panel, LED dies are added and encapsulated before the panel is fractured.
99 Citations
31 Claims
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1. A method for forming an LED package from a panel, the method comprising:
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forming a top body layer of the panel; forming an intermediate body layer of the panel; forming a cavity through a portion of the top body layer and the intermediate body layer corresponding to the center of the LED package; forming a thermally conducting ceramic layer of the panel, the thermally conducting ceramic layer having a top surface and a bottom surface; bonding a metallization pattern including a thermal bonding pad to the top surface of the thermally conducting ceramic layer, the thermal bonding pad configured to thermally bond the top surface of the conducting ceramic layer to an LED; bonding a substantially continuous central pad without a corner on the bottom surface of the thermally conducting ceramic layer, the central pad having a continuously curved periphery and configured to provide a thermal path from the bottom surface of the thermally conducting ceramic layer to a substrate; bonding the intermediate body layer between the top body layer and thermally conducting ceramic layer such that the panel includes the top layer, the intermediate body layer, and the thermally conducting ceramic layer; creating a grid of LED packages in the panel, the grid defined by one or more grooves on a top surface and a bottom surface of the panel; and separating the LED package from the grid of LED packages in the panel by breaking the panel along the one or more grooves of the grid. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 30, 31)
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22. A method for forming a panel of light emitting devices, the method comprising:
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forming a top body layer having an array of cavities; forming an intermediate body layer having an array of cavities; forming a thermally conducting ceramic layer having an array of metallization patterns disposed on its top surface and an array of circular central pads without a corner disposed on its bottom surface opposite the array of metallization patterns, each central pad having a continuously curved periphery and configured to provide a thermal path from the thermally conducting ceramic layer to a substrate; aligning the array of cavities in the top body layer with the array of cavities in the intermediate body layer and the array of metallization patterns and central pads of the thermally conducting ceramic layer; bonding the aligned top body layer, intermediate body layer, the thermally conducting ceramic layer together to form a panel including the top body layer, the intermediate layer, and the thermally conducting layer; disposing a square array of vias through the panel, each square defined by the array of vias including one cavity in the top body layer, one cavity in the intermediate body layer, one metallization pattern, and one central pad; and bonding an LED die to the metallization pattern in each square of the panel to form the panel of light emitting devices, the light emitting devices defined by the array of vias. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29)
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Specification