Plated pillar package formation
First Claim
Patent Images
1. A method of forming a package, the method comprising:
- providing a first sacrificial layer on a substrate, wherein the substrate includes a first seed layer provided thereon;
forming openings in the first sacrificial layer to expose portions of the first seed layer;
plating the exposed portions of the first seed layer with a conductive metal to form pillars;
removing the first sacrificial layer;
providing a first fill material on the substrate adjacent the pillars, wherein an outer surface of the first fill material is planar to an upper surface of the pillars; and
removing the substrate.
2 Assignments
0 Petitions
Accused Products
Abstract
A method involves plating pillars of electrically conductive material up from a seed layer located on a substrate, surrounding the pillars with a fill material so that the pillars and fill material collectively define a first package, and removing the substrate from the first package.
-
Citations
24 Claims
-
1. A method of forming a package, the method comprising:
-
providing a first sacrificial layer on a substrate, wherein the substrate includes a first seed layer provided thereon; forming openings in the first sacrificial layer to expose portions of the first seed layer; plating the exposed portions of the first seed layer with a conductive metal to form pillars; removing the first sacrificial layer; providing a first fill material on the substrate adjacent the pillars, wherein an outer surface of the first fill material is planar to an upper surface of the pillars; and removing the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
-
-
15. A method of forming a package, the method comprising:
-
metalizing at least a portion of a surface of a substrate to form a seed layer; providing a photoresist over the seed layer and the substrate; forming openings in the photoresist to expose portions of the seed layer; plating the exposed portions of the seed layer with a conductive metal to form interconnects; after said plating, removing the photoresist; providing a fill material on the substrate adjacent the interconnects after removing the photoresist, wherein an outer surface of the fill material forms a substantially planar surface with an outer surface of the interconnects; and removing the substrate. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24)
-
Specification