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Plated pillar package formation

  • US 7,670,874 B2
  • Filed: 02/16/2007
  • Issued: 03/02/2010
  • Est. Priority Date: 02/16/2007
  • Status: Expired due to Fees
First Claim
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1. A method of forming a package, the method comprising:

  • providing a first sacrificial layer on a substrate, wherein the substrate includes a first seed layer provided thereon;

    forming openings in the first sacrificial layer to expose portions of the first seed layer;

    plating the exposed portions of the first seed layer with a conductive metal to form pillars;

    removing the first sacrificial layer;

    providing a first fill material on the substrate adjacent the pillars, wherein an outer surface of the first fill material is planar to an upper surface of the pillars; and

    removing the substrate.

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