Membrane IC fabrication
First Claim
1. A method of making an integrated circuit comprising:
- forming a thin substrate with a uniform thickness throughout the extent of the integrated circuit; and
forming at least one of on and in the substrate circuitry including a plurality of integrated circuits having active devices;
wherein the integrated circuit is substantially flexible while retaining its structural integrity.
1 Assignment
0 Petitions
Accused Products
Abstract
General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor layer of the membrane. The semiconductor membrane layer is initially formed from a substrate of standard thickness, and all but a thin surface layer of the substrate is then etched or polished away. In another version, the flexible membrane is used as support and electrical interconnect for conventional integrated circuit die bonded thereto, with the interconnect formed in multiple layers in the membrane. Multiple die can be connected to one such membrane, which is then packaged as a multi-chip module. Other applications are based on (circuit) membrane processing for bipolar and MOSFET transistor fabrication, low impedance conductor interconnecting fabrication, flat panel displays, maskless (direct write) lithography, and 3D IC fabrication.
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Citations
138 Claims
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1. A method of making an integrated circuit comprising:
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forming a thin substrate with a uniform thickness throughout the extent of the integrated circuit; and forming at least one of on and in the substrate circuitry including a plurality of integrated circuits having active devices; wherein the integrated circuit is substantially flexible while retaining its structural integrity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 40, 41, 42, 43, 44, 103, 104, 105, 106, 107, 108)
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14. A method of making an integrated circuit comprising:
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forming a thin substrate with a uniform thickness throughout the extent of the integrated circuit; forming at least one of on and in the substrate circuitry including a plurality of integrated circuits having active devices; and wherein the integrated circuit is elastic while retaining its structural integrity. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 45, 46, 47, 48, 49, 109, 110, 111, 112, 113, 114)
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27. A method of making an integrated circuit comprising:
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forming a thin substrate with a uniform thickness throughout the extent of the integrated circuit; and forming at least one of on and in the substrate circuitry including a plurality of integrated circuits having active devices; wherein the integrated circuit is substantially flexible and elastic while retaining its structural integrity. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 50, 51, 52, 53, 54, 115, 116, 117, 118, 119, 120)
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55. A method of making an integrated circuit comprising:
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providing a thin substrate with a uniform thickness throughout the extent of the integrated circuit; forming at least one of on and in the thin substrate circuitry having a plurality of active devices; and wherein the integrated circuit is substantially flexible while retaining its structural integrity. - View Dependent Claims (56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 121, 122, 123, 124, 125, 126)
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71. A method of making an integrated circuit comprising:
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providing a thin substrate with a uniform thickness throughout the extent of the integrated circuit; forming at least one of on and in the thin substrate circuitry having a plurality of active devices; and wherein the integrated circuit is elastic while retaining its structural integrity. - View Dependent Claims (72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 127, 128, 129, 130, 131, 132)
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87. A method of making an integrated circuit comprising:
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providing a thin substrate with a uniform thickness throughout the extent of the integrated circuit; forming at least one of on and in the thin substrate circuitry having a plurality of active devices; and wherein the integrated circuit is substantially flexible and elastic while retaining its structural integrity. - View Dependent Claims (88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100, 101, 102, 133, 134, 135, 136, 137, 138)
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Specification