Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component

• US 7,673,389 B2
• Filed: 07/19/2005
• Issued: 03/09/2010
• Est. Priority Date: 07/19/2005
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Lehman, Bret W., Singh, Prabjit, Schmidt, Roger R.
• Primary Examiner(s): Bryant; David P
• Assistant Examiner(s): Taousakis; Alexander P
• Application Number:
  US11/184,654
• Publication Number:
  US 20070017658A1
• Time in Patent Office: 1,694 Days
• Field of Search: 298/900.3, 298/900.38, 298/900.4, 298/900.41, 298/900.43, 164/93, 164/98, 164/99, 165/168, 361/702
• US Class Current: 29/890.038
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making
• CPC Class Codes: Y10T 29/49359 Cooling apparatus making, e.g., air conditioner, refrigerator
• CPC Class Codes: Y10T 29/49364 Tube joined to flat sheet longitudinally, i.e., tube sheet
• CPC Class Codes: Y10T 29/49368 with inserted tubes
• CPC Class Codes: Y10T 29/49369 Utilizing bond inhibiting material
• CPC Class Codes: Y10T 29/49373 Tube joint and tube plate structure
• CPC Class Codes: Y10T 29/49377 Tube with heat transfer means
• CPC Class Codes: Y10T 29/49393 with metallurgical bonding

Abstract

Cold plate apparatuses and methods of fabrication are provided for facilitating cooling of an electronics component. The fabrication approach includes: forming a tube with a first metal and having first and second ends with a heat transfer region disposed therebetween; positioning the heat transfer region of the tube within a mold and casting a heat sink member around the tube by contacting a second metal in molten form over the tube, wherein the first and second metals react peritectically to form an alloy layer between the tube and the heat sink member, and a metallurgical bond is formed between the tube and heat sink member with cooling of the molten second metal; and controlling casting of the heat sink member to minimize a thickness of the alloy layer to enhance a heat transfer characteristic of the metallurgical bond formed between the tube and the heat sink member.

Claims

1. A method of fabricating a cold plate apparatus for facilitating cooling of a heat generating electronics component, the method comprising:

forming a tube comprising a first metal, the tube having a first end and a second end with a heat transfer region disposed therebetween;

positioning the heat transfer region of the tube within a mold and casting a heat sink member around the heat transfer region of the tube by contacting a second metal in molten form over the heat transfer region of the tube, wherein the second metal has a lower melting point than the first metal, the first metal of the tube and the molten second metal react peritectically during casting of the heat sink member to form an alloy layer between the tube and the heat sink member in the heat transfer region of the tube, and a metallurgical bond is formed between the tube and the heat sink member in the heat transfer region of the tube with cooling of the molten second metal, and wherein the first end and the second end of the tube extend from the heat sink member; and

controlling the casting of the heat sink member to minimize a thickness of the alloy layer formed between the tube and the heat sink member in the heat transfer region of the tube, wherein minimizing the thickness of the alloy layer enhances a heat transfer characteristic of the metallurgical bond formed between the tube and the heat sink member.

2. The method of claim 1, wherein forming the tube comprises forming a tube structure with a coating over an outer surface thereof, the coating comprising the first metal, and wherein the tube structure comprises a third metal, which if exposed to the molten second metal, would react peritectically therewith, the first metal of the coating isolating the third metal from the molten second metal in the heat transfer region of the tube during the casting of the heat sink member.

3. The method of claim 2, wherein the first metal comprises one of niobium, chromium, hafnium, tantalum, zirconium, titanium and tungsten, the second metal comprises aluminum, and the third metal comprises one of copper, cobalt, iron, lithium, magnesium and nickel.

4. The method of claim 2, wherein forming the tube further comprises coating the outer surface of the tube structure with the first metal to a thickness in the range of 0.02-0.2 mm, the coating comprising employing at least one of sputtering, physical vapor deposition, ion vapor deposition, electroplating or electroless plating the first metal over the outer surface of the tube structure.

5. The method of claim 1, wherein the first metal comprises one of niobium, chromium, hafnium, tantalum, zirconium, titanium and tungsten, and the second metal comprises aluminum.

6. The method of claim 1, wherein the second metal comprises aluminum, and the controlling the casting further comprises pouring molten aluminum into the mold at a temperature below 750°

.

7. The method of claim 1, wherein forming the tube further comprises forming the tube with a sinusoidal shape in the heat transfer region thereof.

8. The method of claim 1, further comprising casting the heat sink member with at least one surface thereof configured to mate to at least one surface of the heat generating electronics component, and polishing the at least one surface of the heat sink member to facilitate coupling thereof to the at least one surface of the heat generating electronics component.