System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology

• US 7,675,000 B2
• Filed: 12/16/2004
• Issued: 03/09/2010
• Est. Priority Date: 06/24/2003
• Status: Expired due to Fees

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Redeker, Fred C., Boyd, John M.
• Primary Examiner(s): ELVE, MARIA ALEXANDRA
• Application Number:
  US11/016,381
• Publication Number:
  US 20060088982A1
• Time in Patent Office: 1,909 Days
• Field of Search: 219/121.67, 219/121.72, 219/121.85, 219/121.84, 219/121.82, 219/121.83
• US Class Current: 219/121.67
• CPC Class Codes: B08B 3/04 Cleaning involving contact with liquid
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/1224 in vacuum
• CPC Class Codes: B23K 26/146 the fluid stream containing a liquid
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: H01L 21/02052 Wet cleaning only H01L21/02085 takes precedence
• CPC Class Codes: H01L 21/02057 Cleaning during device manufacture
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: H01L 21/67034 for drying
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304

Abstract

A substrate processing system includes a first, movable surface tension gradient device, a dicing device and a system controller. The first, movable surface tension gradient device is capable of supporting a first process within a first meniscus. The first meniscus being supported between the first surface tension gradient device and a first surface of the substrate. The first movable surface tension gradient device capable of being moved relative to the first surface of the substrate. The dicing device is oriented to a desired dicing location. The desired dicing location being encompassed by the meniscus. The system controller is coupled to the dicing device and the surface tension gradient device. The system controller includes a process recipe. A method for dicing a substrate is also described.

Claims

1. A substrate processing system comprising:

a first proximity head capable of supporting a first process within a first meniscus, the first proximity head including a first surface, the first surface including;

a first plurality of outlet ports; and

a first plurality of inlet ports including;

a first portion of the first plurality of inlet ports being coupled to an at least one process liquid source; and

a second portion of the first plurality of inlet ports being coupled to a tensio-active substance source, the second portion of the first plurality of inlet ports being disposed along a periphery of the first plurality of outlet ports; and

the first plurality of outlet ports being disposed along a periphery of the first portion of the first plurality of inlet ports, the first plurality of outlet ports being coupled to a vacuum source, the first meniscus being supported between the first proximity head and a first surface of the substrate, the first surface of the first proximity head being substantially parallel to the first surface of the substrate, the first proximity head capable of being moved relative to the first surface of the substrate;

a dicing laser source oriented to direct a laser to a desired dicing location, the desired dicing location being encompassed by the first meniscus;

a second proximity head capable of supporting a second process within a second meniscus, the second proximity head including a second surface, the second surface including;

a second plurality of outlet ports; and

a second plurality of inlet ports including;

a first portion of the second plurality of inlet ports being coupled to the at least one process liquid source;

a second portion of the second plurality of inlet ports being coupled to the tensio-active substance source, the second portion of the second plurality of inlet ports being disposed along a periphery of the second plurality of outlet ports; and

the second plurality of outlet ports being disposed along a periphery of the first portion of the second plurality of inlet ports, the second plurality of outlet ports being coupled to the vacuum source, the second meniscus being supported between the second proximity head and a second surface of the substrate, the second surface of the second proximity head being substantially parallel to the second surface of the substrate, the second surface being opposite the first surface, the second proximity head capable of being moved relative to the second surface of the substrate;

a laser absorbing target capable of being supported in a position corresponding to the desired dicing location; and

a system controller being coupled to the dicing laser source and the first and second proximity heads, the system controller including a recipe.

2. A substrate processing system comprising:

a first, movable surface tension gradient device capable of supporting a first process within a first meniscus, the first, movable surface tension gradient device including;

a first surface, the first surface including;

a first plurality of outlet ports; and

a first plurality of inlet ports including;

a first portion of the first plurality of inlet ports being coupled to an at least one process liquid source; and

a second portion of the first plurality of inlet ports being coupled to a tensio-active substance source, the second portion of the first plurality of inlet ports being disposed along a periphery of the first plurality of outlet ports; and

the first plurality of outlet ports being disposed along a periphery of the first portion of the first plurality of inlet ports, the first plurality of outlet ports being coupled to a vacuum source;

the first meniscus being supported between the first surface of the first surface tension gradient device and a first surface of the substrate;

the first surface of the first surface tension gradient device being substantially parallel to the first surface of the substrate, the first movable surface tension gradient device capable of being moved relative to the first surface of the substrate;

a dicing device oriented to a desired dicing location, the desired dicing location being encompassed by the meniscus; and

a system controller being coupled to the dicing device and the surface tension gradient device, the system controller including a recipe.

3. The system of claim 2, wherein the process includes at least one of a group of processes consisting of a cleaning process, a drying process, a rinsing process, an etch process, a deposition process, and an electroplating process.

4. The system of claim 2, wherein supporting the process includes coupling a process fluid source to the first plurality of inlet ports and coupling a vacuum source to the first plurality of outlet ports.

5. The system of claim 2, wherein supporting the process includes moving the meniscus relative to the first surface of the substrate.

6. The system of claim 2, wherein moving the meniscus relative to the first surface of the substrate includes drying the first surface.

7. The system of claim 2, wherein the dicing device includes a laser.

8. The system of claim 7, wherein the laser includes a water-jet laser.

9. The system of claim 2, wherein the surface tension gradient device includes a proximity head.

10. The system of claim 2, wherein the meniscus includes a dry region substantially surrounding the desired dicing location.

11. The system of claim 2, wherein the dicing device can be moved with the surface tension gradient device.

12. The system of claim 2, wherein the dicing device can be moved independent from the surface tension gradient device.

13. The system of claim 2, further comprising a sensor capable of monitoring the desired dicing location.

14. The system of claim 2, further comprising a dicing target supported on a second surface of the substrate, the second surface being opposite the first surface, the dicing target being supported in a position corresponding to the desired dicing location.

15. The system of claim 14, wherein the dicing device is a laser and the dicing target is a laser absorbing target.

16. The system of claim 2, further comprising a second, movable surface tension gradient device capable of supporting a second process within a second meniscus, the second, movable surface tension gradient device including-a second surface, the second surface including:

a second plurality of outlet ports; and

a second plurality of inlet ports;

the second meniscus being supported between the second surface tension gradient device and a second surface of the substrate, the second surface of the second surface tension gradient device being substantially parallel to the second surface of the substrate, the second surface being opposite the first surface, the second movable surface tension gradient device capable of being moved relative to the second surface of the substrate.