Multi-gate field effect transistor

• US 7,675,117 B2
• Filed: 11/14/2006
• Issued: 03/09/2010
• Est. Priority Date: 11/14/2006
• Status: Active Grant

• Current Assignee: IQE, PLC
• Original Assignee: Translucent Inc. (Silex Systems Ltd.)
• Inventors: Atanackovic, Petar
• Primary Examiner(s): Vu; David
• Assistant Examiner(s): Taylor; Earl N
• Application Number:
  US11/559,690
• Publication Number:
  US 20080111195A1
• Time in Patent Office: 1,211 Days
• Field of Search: 257/250, 257/310, 257/342, 257/365, 257/E29.132, 438/283, 252/521.1
• US Class Current: 257/366
• CPC Class Codes: H01L 29/4908 for thin film semiconductor, e.g. gate of TFT
• CPC Class Codes: H01L 29/66772 Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates H01L29/66666 takes precedence; thin film FinFETs H01L29/66795
• CPC Class Codes: H01L 29/78648 arranged on opposing sides of the channel
• CPC Class Codes: H01L 29/78654 Monocrystalline silicon transistors

Abstract

A planar, double-gate transistor structure comprising upper and lower gate stacks that each comprises a single-phase high-K dielectric gate dielectric is disclosed. The transistor structure is particularly suitable for fully-depleted silicon-on-insulator electronics having gate-lengths less than 65 nm.

Claims

1. A transistor structure comprising:

a first semiconductor layer, wherein said first semiconductor layer comprises a first semiconductor, and wherein said first semiconductor layer has a substantially single-crystal crystal structure;

a first gate stack comprising a first gate dielectric layer and a first gate conductor layer, wherein said first gate dielectric layer comprises a first rare-earth metal, and wherein said first gate dielectric layer has a substantially single-phase crystal structure; and

a second gate stack comprising a second gate dielectric layer and a second gate conductor layer, wherein said second gate dielectric layer comprises a second rare-earth metal, and wherein said second gate dielectric layer has a substantially single-phase crystal structure;

wherein said first semiconductor layer interposes said first gate dielectric layer and said second gate dielectric layer, and wherein said first gate dielectric layer interposes said first semiconductor layer and said first gate conductor layer, and further wherein said second gate dielectric layer interposes said first semiconductor layer and said second gate conductor layer.

2. The transistor structure of claim 1 wherein said first gate dielectric layer comprises at least one of a rare-earth oxide, a rare-earth oxynitride, a rare-earth nitride, a rare-earth oxyphosphide, and a rare-earth phosphide, and wherein said second gate dielectric layer comprises at least one of a rare-earth oxide, a rare-earth oxynitride, a rare-earth nitride, a rare-earth oxyphosphide, and a rare-earth phosphide.

3. The transistor structure of claim 1 wherein said first rare-earth metal is individually selected from the group consisting of erbium, ytterbium, dysprosium, holmium, thulium, and lutetium, and wherein said second rare-earth metal is individually selected from the group consisting of erbium, ytterbium, dysprosium, holmium, thulium, and lutetium.

4. The transistor structure of claim 1 wherein at least one of said first rare-earth metal and said second rare-earth metal forms a cation having a radius less than 0.93 angstroms.

5. The transistor structure of claim 1 wherein at least one of said first rare-earth metal and said second rare-earth metal has an atomic number greater than or equal to 66.

6. The transistor structure of claim 1 wherein at least one of said first rare-earth metal and said second rare-earth metal is in a RE³⁺ ionization state.

7. The transistor structure of claim 1 wherein at least one of said first gate dielectric layer and said second gate dielectric layer has an anion-vacancy-derived fluorite-crystal crystal structure.

8. The transistor structure of claim 1 further comprising a substrate having an electrically-conductive surface, and wherein said first gate conductor layer comprises said electrically-conductive surface.

9. The transistor structure of claim 1 further comprising a substrate having a second semiconductor layer disposed on a buried dielectric layer, wherein said second semiconductor layer has a substantially single-crystal crystal structure, and wherein said first gate conductor comprises said second semiconductor layer.

10. The transistor structure of claim 1 wherein said first gate conductor layer comprises a silicide comprising a third rare-earth metal.

11. The transistor structure of claim 1 wherein said first semiconductor layer has a thickness that is within the range of approximately 5 nm to approximately 25 nm.

12. The transistor structure of claim 1 wherein said first semiconductor layer has a thickness that is within the range of approximately 0.5 nm to approximately 5 nm.

13. The transistor structure of claim 1 wherein said first semiconductor layer is selected from the group consisting of silicon, germanium, silicon-germanium, and silicon-carbide.

14. The transistor structure of claim 1 wherein said first gate dielectric layer has a thickness within the range of approximately 0.5 nm to approximately 100 nm.

15. The transistor structure of claim 1 wherein said first gate dielectric layer has a thickness within the range of approximately 0.5 nm to approximately 10 nm.

16. The transistor structure of claim 1 wherein said first gate dielectric layer has a thickness within the range of approximately 0.5 nm to approximately 2 nm.

17. The transistor structure of claim 1 wherein said second gate dielectric layer has a thickness within the range of approximately 0.5 nm to approximately 10 nm.

18. The transistor structure of claim 1 wherein said second gate dielectric layer has a thickness within the range of approximately 0.5 nm to approximately 2 nm.

19. The transistor structure of claim 1 wherein said first gate conductor layer and said second gate conductor layer are electrically-connected.

20. The transistor structure of claim 1 wherein said first gate conductor layer has a first gate length, and wherein said second gate conductor layer has a second gate length;

wherein said first gate length and said second gate length are equal.

21. A transistor structure comprising:

a substrate comprises a lower gate conductor layer, and wherein said lower gate conductor layer has a substantially single-crystal crystal structure;

a lower gate dielectric layer disposed on said lower gate conductor layer, wherein said lower gate dielectric layer comprises a first rare-earth metal, and wherein said lower gate dielectric layer has a substantially single-phase crystal structure;

a first semiconductor layer disposed on said lower gate dielectric layer, wherein said first semiconductor layer comprises a first semiconductor, and wherein said first semiconductor layer has a substantially single-crystal crystal structure;

an upper gate dielectric layer disposed on said first semiconductor layer, wherein said upper gate dielectric layer comprises a second rare-earth metal, and wherein said upper gate dielectric layer has a substantially single-phase crystal structure; and

an upper gate conductor layer disposed on said upper gate dielectric layer.

22. The transistor structure of claim 21 wherein said upper gate conductor layer comprises a second semiconductor selected from the group consisting of silicon, germanium, silicon-germanium, and silicon-carbide, and wherein said second semiconductor has a substantially single-crystal crystal structure.

23. The transistor structure of claim 21 wherein said lower gate conductor layer comprises silicide comprising a third rare-earth metal.

24. The transistor structure of claim 21 wherein said lower gate conductor layer comprises a second semiconductor layer disposed on a buried dielectric, and wherein said second semiconductor layer has a substantially single-crystal crystal structure.

25. The transistor structure of claim 21 wherein said lower gate conductor layer and said upper gate conductor layer are electrically-connected.

26. The transistor structure of claim 21 wherein at least one of said lower gate dielectric layer and said upper gate dielectric layer comprises at least one of a rare-earth oxide, a rare-earth oxynitride, a rare-earth nitride, a rare-earth oxyphosphide, and a rare-earth phosphide.

27. The transistor structure of claim 21 wherein at least one of said lower gate dielectric layer and said upper gate dielectric layer has an anion-vacancy-derived fluorite-crystal crystal structure.

28. The transistor structure of claim 21 wherein at least one of said first rare-earth metal and said second rare-earth metal forms a cation having a radius less than 0.93 angstroms.

29. The transistor structure of claim 21 wherein at least one of said first rare-earth metal and said second rare-earth metal has an atomic number greater than or equal to 66.

30. The transistor structure of claim 21 wherein at least one of said first rare-earth metal and said second rare-earth metal is in a RE³⁺ ionization state.

31. A transistor structure comprising:

a first dielectric layer disposed on a substrate;

a first semiconductor layer disposed on said first dielectric layer, wherein said first semiconductor layer has a substantially single-crystal crystal structure, and wherein said first semiconductor layer includes a source region and a drain region, and further wherein said first semiconductor layer has at least two sidewalls;

a second dielectric layer, wherein said second dielectric layer is disposed on at least said two sidewalls of said first semiconductor layer, and wherein said second dielectric layer comprises a rare-earth metal, and further wherein said second dielectric layer has a substantially single-phase crystal structure; and

a gate conductor layer, wherein said gate conductor layer is disposed on said second dielectric layer, and wherein said second dielectric layer interposes each of said two sidewalls and said gate conductor layer.

32. A method comprising:

forming a lower gate conductor layer, wherein said lower gate conductor layer has a substantially single-crystal crystal structure;

forming a lower gate dielectric layer comprising a first rare-earth metal and having a single-phase crystal structure;

forming an first semiconductor layer, wherein said first semiconductor layer has a substantially single-crystal crystal structure; and

forming a source region and a drain region in said first semiconductor layer;

wherein said lower gate dielectric layer interposes said lower gate conductor and said first semiconductor layer.

33. The method of claim 32 further comprising forming an upper gate dielectric layer comprising a second rare-earth metal and having a single-phase crystal structure.

34. The method of claim 33 further comprising forming an upper gate conductor layer having a single-crystal crystal structure.

35. The method of claim 34 wherein:

said lower gate dielectric layer is formed by epitaxial growth;

said first semiconductor layer is formed by epitaxial growth;

said upper gate dielectric layer is formed by epitaxial growth; and

said upper gate conductor layer is formed by epitaxial growth.

36. The method of claim 34 further comprising forming an electrical interconnect between said upper gate conductor and said lower gate conductor.

37. The method of claim 32 wherein said lower gate conductor layer is formed by forming a rare-earth silicide on a surface of a silicon substrate.

38. The method of claim 32 wherein said lower gate conductor layer is formed by disposing an electrically-conductive semiconductor layer on a buried dielectric layer that is disposed on a handle wafer.

39. The method of claim 38 wherein said lower gate conductor layer and said buried dielectric layer are formed by epitaxial growth.