Apparatus and method for packaging circuits

• US 7,675,169 B2
• Filed: 11/02/2007
• Issued: 03/09/2010
• Est. Priority Date: 10/08/2001
• Status: Expired due to Fees

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Yu, Chan Min, Seng, Hu Kwok, Leng, Ser Bok, Chung, So Chee, Waf, Low Slu, Jeung, Boon Suan, Poo, Chia Yong, Loo, Neo Yong, Koon, Eng Meow, Kwang, Chua Swee
• Primary Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US11/934,556
• Publication Number:
  US 20080054423A1
• Time in Patent Office: 858 Days
• Field of Search: 257/723, 257/734, 257/735, 257/773, 257/776, 257/780, 257/781, 257/786, 257/693, 257/730, 257/E23.019, 257/E23.022, 257/E23.17, 257/E21.507
• US Class Current: 257/734
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2224/0231 Manufacturing methods of the redistribution layers
• CPC Class Codes: H01L 2224/02311 Additive methods
• CPC Class Codes: H01L 2224/02313 Subtractive methods
• CPC Class Codes: H01L 2224/02331 Multilayer structure
• CPC Class Codes: H01L 2224/02371 connecting the bonding area on a surface of the semiconductor or solid-state body with another surface of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/02375 Top view
• CPC Class Codes: H01L 2224/02379 Fan-out arrangement
• CPC Class Codes: H01L 2224/0239 Material of the redistribution layers
• CPC Class Codes: H01L 2224/03 Manufacturing methods
• CPC Class Codes: H01L 2224/0345 Physical vapour deposition [PVD], e.g. evaporation, or sputtering
• CPC Class Codes: H01L 2224/03452 Chemical vapour deposition [CVD], e.g. laser CVD
• CPC Class Codes: H01L 2224/0361 Physical or chemical etching
• CPC Class Codes: H01L 2224/03622 using masks
• CPC Class Codes: H01L 2224/039 Methods of manufacturing bonding areas involving a specific sequence of method steps
• CPC Class Codes: H01L 2224/05548 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05569 the external layer being disposed on a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/056 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/08237 : the bonding area connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/80357 : being flush with the surface
• CPC Class Codes: H01L 2224/804 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/80898 : Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
• CPC Class Codes: H01L 2224/93 : Batch processes
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/08 : of an individual bonding area
• CPC Class Codes: H01L 24/80 : Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
• CPC Class Codes: H01L 24/93 : Batch processes
• CPC Class Codes: H01L 27/105 : including field-effect components
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/05042 : Si3N4
• CPC Class Codes: H01L 2924/10156 : at the periphery
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/19041 : being a capacitor

Abstract

Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.

Claims

1. A circuit module, comprising:

a support structure having a plurality of conductors;

at least one mount located on the support structure that is communicatively coupled to the plurality of conductors;

an integrated circuit die coupled to the mount, the integrated circuit die comprising;

a main body including a top layer, a bottom layer, and a peripheral surface extending between the top layer and the bottom layer;

a bond pad on the main body;

an edge contact embedded in the peripheral surface configured to be communicatively coupled to corresponding contacts in the mount; and

a line connecting the bond pad to the edge contact.

2. The circuit module of claim 1, wherein the integrated circuit die includes one of a DRAM, a SRAM, an SDRAM, an EEPROM, and a flash memory device.

3. The circuit module of claim 1, wherein the mount is configured to removably receive the integrated circuit die.

4. The circuit module of claim 1, wherein the mount comprises a land pattern configured to provide electrical contact between the edge contact of the integrated circuit die and the plurality of conductors.

5. The circuit module of claim 1, wherein the support structure includes an encapsulant that is distributed on at least a portion of the support structure.

6. A circuit module, comprising:

a support having a plurality of mounts positioned on the support, each of the mounts communicatively coupled to a plurality of leads extending outwardly from the mounts and configured to provide bidirectional communications between the mounts and external circuits;

an integrated circuit die coupled to the mount, the integrated circuit die comprising;

a main body including a first layer, an opposing second layer, and a peripheral surface extending between the first layer and the second layer;

a bond pad positioned on the main body;

an edge contact embedded in the peripheral surface and configured to communicatively couple to a selected lead; and

a line coupling the bond pad to the edge contact.

7. The circuit module of claim 6, wherein the mount is configured to removably receive the integrated circuit die.

8. The circuit module of claim 6, wherein the mount includes a land pattern configured to provide electrical contact between the edge contact and the selected lead.

9. The circuit module of claim 6, wherein the edge contact is positioned above a second surface of the second layer such that the edge contact does not increase a height of the die.

10. The circuit module of claim 6, wherein the main body has a first height and the edge contact has a second height, further wherein the first height is approximately equal to the second height.

11. A module, comprising:

at least one mount communicatively coupled to a plurality of leads extending outwardly from the mounts and configured to provide bidirectional communications between the mounts and external circuits;

an integrated circuit die coupled to the mount, the integrated circuit die comprising;

a main body including a first layer, an opposing second layer, and a peripheral surface extending between the first layer and the second layer;

a bond pad disposed on the main body;

an edge contact disposed on the peripheral surface configured to communicatively couple to a selected lead; and

a line coupling the bond pad to the edge contact.

12. The module of claim 11, wherein the mount is configured to removably receive the integrated circuit die.

13. The module of claim 11, wherein the mount is configured to provide electrical contact between the edge contact and the selected lead using a solder reflow process.

14. The module of claim 11, wherein the edge contact is positioned above a second surface of the second layer such that the edge contact does not increase a height of the die.

15. An electrical module including a plurality of mounting locations operatively coupled to leads extending outwardly from the mounting locations, comprising:

a plurality of integrated circuit dies coupled to corresponding mounts, each of the integrated circuit dies having a main body that includes a first layer, an opposing second layer, and a peripheral surface extending between the first layer and the second layer;

a bond pad positioned on the main body;

an edge contact positioned on the peripheral surface that is configured to be communicatively coupled to a selected lead; and

a line coupling the bond pad to the edge contact.

16. The electrical module of claim 15, wherein at least one of the plurality of integrated circuit dies includes a memory device, and another of the plurality of integrated circuit dies includes a processor.

17. The electrical module of claim 15, wherein the mounting includes a land pattern configured to provide electrical contact between the edge contact and the selected lead.

18. An electrical module including a plurality of mounting locations positioned on a supporting substrate and operatively coupled to leads extending outwardly from the mounting locations, comprising:

a plurality of integrated circuit dies coupled to corresponding mounts, each of the integrated circuit dies having a main body that includes a first layer, an opposing second layer, and a peripheral surface extending between the first layer and the second layer;

a bond pad positioned on the main body;

an edge contact positioned on the peripheral surface that is configured to be communicatively coupled to a selected lead; and

a line coupling the bond pad to the edge contact.

19. The electrical module of claim 18, wherein at least one of the mounting locations is configured to removably receive the integrated circuit die.

20. The electrical module of claim 18, wherein at least one of the plurality of integrated circuit dies includes a memory device, and another of the plurality of integrated circuit dies includes a processor.