Stacked electronic component package having film-on-wire spacer
First Claim
Patent Images
1. A stacked electronic component package comprising:
- a first electronic component having a first surface, a second surface, and sides, the second surface of the first electronic component comprising bond pads;
a film-on-wire spacer coupled to and covering the second surface of the first electronic component including the bond pads, the film-on-wire spacer comprising;
an upper film adhesive comprising a first adhesive;
a dielectric spacer comprising sides; and
a lower film adhesive comprising a second adhesive different than the first adhesive, the lower film adhesive comprising sides, wherein the sides of the first electronic component, the sides of the lower film adhesive and the sides of the spacer are substantially vertical and coincident with one another; and
a second electronic component having a first surface coupled to the film-on-wire spacer.
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Accused Products
Abstract
A film-on-wire spacer covers an entire upper surface of a lower electronic component. Accordingly, an upper electronic component is supported above bond pads and lower bond wires of the lower electronic component. This decreases the stress on the upper electronic component, e.g., during wirebonding, and thus decreases the chance of cracking the upper electronic component. Further, the lower bond wires are enclosed in and protected by the film-on-wire spacer. Further, the film-on-wire spacer is thin resulting in a minimum height of the stacked electronic component package.
213 Citations
19 Claims
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1. A stacked electronic component package comprising:
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a first electronic component having a first surface, a second surface, and sides, the second surface of the first electronic component comprising bond pads; a film-on-wire spacer coupled to and covering the second surface of the first electronic component including the bond pads, the film-on-wire spacer comprising; an upper film adhesive comprising a first adhesive; a dielectric spacer comprising sides; and a lower film adhesive comprising a second adhesive different than the first adhesive, the lower film adhesive comprising sides, wherein the sides of the first electronic component, the sides of the lower film adhesive and the sides of the spacer are substantially vertical and coincident with one another; and a second electronic component having a first surface coupled to the film-on-wire spacer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A stacked electronic component package comprising:
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a first electronic component having a first surface, a second surface, and sides, the second surface of the first electronic component comprising bond pads; a film-on-wire spacer coupled to and covering the second surface of the first electronic component including the bond pads, the film-on-wire spacer comprising; an upper film adhesive; a dielectric spacer comprising sides; and a lower film adhesive comprising sides, wherein the sides of the first electronic component, the sides of the lower film adhesive and the sides of the spacer are substantially vertical and coincident with one another; and lower bond wires coupled to the bond pads of the first electronic component, the lower bond wires being enclosed within and protected by the lower film adhesive; and a second electronic component having a first surface coupled to the film-on-wire spacer. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A stacked electronic component package comprising:
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a substrate comprising first traces on a first surface of the substrate; a first electronic component having a first surface, a surface, and sides, the first surface of the first electronic component being coupled to the first surface of the substrate, the second surface of the first electronic component comprising bond pads; a film-on-wire spacer coupled to and covering the second surface of the first electronic component including the bond pads, the film-on-wire spacer comprising; an upper film adhesive comprising a first adhesive; a dielectric spacer comprising sides; and a lower film adhesive comprising a second adhesive different than the first adhesive, the lower film adhesive comprising sides, wherein the sides of the first electronic component, the sides of the lower film adhesive and the sides of the spacer are substantially vertical and coincident with one another; and lower bond wires coupled to the bond pads of the first electronic component and the first traces, the lower bond wires being enclosed within and protected by the lower film adhesive; and a second electronic component having a first surface coupled to the film-on-wire spacer. - View Dependent Claims (15, 16, 17)
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18. A stacked electronic component package comprising:
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a first electronic component having a first surface, a second surface, and sides, the second surface of the first electronic component comprising bond pads; a film-on-wire spacer coupled to and covering the second surface of the first electronic component including the bond pads, the film-on-wire spacer comprising; an upper film adhesive comprising sides; a dielectric spacer comprising sides; and a lower film adhesive comprising sides; lower bond wires coupled to the bond pads of the first electronic component, the lower bond wires being enclosed within and protected by the lower film adhesive; and a second electronic component having a first surface coupled to the film-on-wire spacer, a second surface, and sides, wherein the sides of the first electronic component, the sides of the lower film adhesive, the sides of the spacer, the sides of the upper film adhesive and the sides of the second electronic component are substantially vertical and coincident with one another. - View Dependent Claims (19)
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Specification