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Stacked electronic component package having film-on-wire spacer

  • US 7,675,180 B1
  • Filed: 02/17/2006
  • Issued: 03/09/2010
  • Est. Priority Date: 02/17/2006
  • Status: Active Grant
First Claim
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1. A stacked electronic component package comprising:

  • a first electronic component having a first surface, a second surface, and sides, the second surface of the first electronic component comprising bond pads;

    a film-on-wire spacer coupled to and covering the second surface of the first electronic component including the bond pads, the film-on-wire spacer comprising;

    an upper film adhesive comprising a first adhesive;

    a dielectric spacer comprising sides; and

    a lower film adhesive comprising a second adhesive different than the first adhesive, the lower film adhesive comprising sides, wherein the sides of the first electronic component, the sides of the lower film adhesive and the sides of the spacer are substantially vertical and coincident with one another; and

    a second electronic component having a first surface coupled to the film-on-wire spacer.

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