Plated antenna for high frequency devices
First Claim
1. A method for making a double-sided electronic device on a semiconductor substrate having one or more pre-formed connection holes through the substrate, comprising the steps of:
- a) forming a first metal pattern on a first side of the substrate, including in the connection holes, the first metal pattern comprising a first coil and at least one first shunt bar connecting at least two loops in the first coil, wherein forming said first metal pattern comprises printing a first ink pattern comprising a plating material and a solvent, said plating material comprising an organometallic compound or suspension of metal nanoparticles which, after heating sufficiently to remove substantially all carbon-based material, provides a surface on which the metal can be electroplated or electrolessly plated;
b) forming a second metal pattern on a second side of the substrate, in alignment with the connection holes, the second metal pattern comprising a second coil and at least one second shunt bar connecting at least two loops in the second coil, wherein the first metal pattern is coupled to the second metal pattern through a connection formed in said connection hole; and
c) electrically disconnecting the first and second shunt bars.
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Accused Products
Abstract
A method of making a double-sided antenna for high frequency devices is discussed. The method includes forming metal patterns on both sides of a substrate having pre-formed connection holes. Preferably, the metal patterns are formed using a printing ink having a precursor and a solvent. In one embodiment, the metal patterns include coils which are formed on both sides of the substrate. In one embodiment, shunt bars are used to speed up the process of making the metal patterns. The shunt bars are punched out at the end of the process to electrically isolate the metal patterns.
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Citations
29 Claims
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1. A method for making a double-sided electronic device on a semiconductor substrate having one or more pre-formed connection holes through the substrate, comprising the steps of:
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a) forming a first metal pattern on a first side of the substrate, including in the connection holes, the first metal pattern comprising a first coil and at least one first shunt bar connecting at least two loops in the first coil, wherein forming said first metal pattern comprises printing a first ink pattern comprising a plating material and a solvent, said plating material comprising an organometallic compound or suspension of metal nanoparticles which, after heating sufficiently to remove substantially all carbon-based material, provides a surface on which the metal can be electroplated or electrolessly plated; b) forming a second metal pattern on a second side of the substrate, in alignment with the connection holes, the second metal pattern comprising a second coil and at least one second shunt bar connecting at least two loops in the second coil, wherein the first metal pattern is coupled to the second metal pattern through a connection formed in said connection hole; and c) electrically disconnecting the first and second shunt bars. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method for making a double-sided electronic device on a semiconductor substrate having one or more pre-formed connection holes through the substrate, comprising the steps of:
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a) forming a first metal pattern on a first side of the substrate, including in the connection holes, the first metal pattern comprising a first coil and at least one first shunt bar connecting at least two loops in the first coil, wherein forming said first metal pattern comprises printing a first ink pattern comprising metal nanoparticles and a solvent; b) forming a second metal pattern on a second side of the substrate, in alignment with the connection holes, the second metal pattern comprising a second coil and at least one second shunt bar connecting at least two loops in the second coil, wherein the first metal pattern is coupled to the second metal pattern through a connection formed in said connection hole; and c) electrically disconnecting the first and second shunt bars. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29)
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Specification