Method to reduce module inductance

• US 7,676,911 B2
• Filed: 02/09/2007
• Issued: 03/16/2010
• Est. Priority Date: 09/20/2000
• Status: Expired due to Fees

• Current Assignee: Continental Automotive Systems US Incorporated (Continental AG)
• Original Assignee: Continental Automotive Systems US Incorporated (Continental AG)
• Inventors: Flett, Fred
• Primary Examiner(s): ARBES, CARL J
• Application Number:
  US11/673,279
• Publication Number:
  US 20070193763A1
• Time in Patent Office: 1,131 Days
• Field of Search: 295/921, 295/96, 298/25, 298/30
• US Class Current: 29/825
• CPC Class Codes: H01L 2223/665 Bias feed arrangements
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/09345 Power and ground in the same plane; Power planes for two voltages in one plane
• CPC Class Codes: H05K 2201/10446 Mounted on an edge
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2203/049 Wire bonding
• CPC Class Codes: H05K 7/00 Constructional details common to different types of electric apparatus casings, cabinets, drawers H05K5/00
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14329 specially adapted for the configuration of power bus bars
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49009 Dynamoelectric machine
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.

Claims

1. A method of reducing inductance in a power module comprising:

allowing DC current to flow symmetrically and directly to the switches of the module;

permitting counter-flow of electric currents, thereby canceling magnetic fields and their associated inductances; and

simultaneously positioning the positive and negative leads in close proximity to one another thereby canceling the magnetic fields and their associated inductance.

2. The method of claim 1, further comprising:

mounting a DC positive bus plate and a DC negative bus plate parallel to one another between the high and the low side of the power module.

3. The method of claim 1, further comprising:

placing an insulating layer between the positive bus and the negative bus.

4. The method of claim 1, further comprising:

providing separate power leads to each half-bridge of the power module.

5. The method of claim 1 wherein said step of allowing DC current to flow symmetrically and directly to the switches of the module comprises:

allowing current to flow from a negative terminal of a power source directly to said switches without being redirected through any additional components, and

allowing current to flow from a positive terminal of a power source directly to said switches without being redirected through any additional components.

6. The method of claim 5 wherein said step of allowing DC current to flow symmetrically and directly to the switches of the module comprises allowing current from a negative terminal of a power source, and current from a positive terminal of a power source to flow symmetrically to said switches.

7. The method of claim 1 wherein said step of allowing DC current to flow symmetrically and directly to the switches of the module comprises allowing current from a negative terminal of a power source, and current from a positive terminal of a power source to flow symmetrically to said switches.

8. The method of claim 1 wherein a first circuit within said module directly connected to a positive lead of said module and a second circuit within said module directly connected to a negative lead of said module are symmetrical.

9. The method of claim 8 wherein said first and second circuits are symmetrical about an axis defined by adjacent edges of said first and second circuit.