Manufacturing of a photo-radiation source by binding multiple light emitting chips without use of solder or wiring bonding

• US 7,677,943 B2
• Filed: 04/20/2006
• Issued: 03/16/2010
• Est. Priority Date: 03/29/2004
• Status: Expired due to Fees

• Current Assignee: Articulated Technologies, LLC
• Original Assignee: Articulated Technologies, LLC
• Inventors: Nelson, Gregory V., Daniels, John J.
• Primary Examiner(s): Santiago; Mariceli
• Application Number:
  US11/409,410
• Publication Number:
  US 20060252336A1
• Time in Patent Office: 1,426 Days
• Field of Search: 445 24- 25, 257 98-100, 313/498, 313/512
• US Class Current: 445/25
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G03G 15/6582 Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 428/917 Electroluminescent

Abstract

A method of manufacturing a photo-radiation source comprising the steps of providing a first planar conductor; disposing a formation of light emitting chips on the first planar conductor, each chip having a cathode and an anode, one of the cathode and anode of each chip being in contact with the first planar conductor. The method of manufacturing a photo-radiation source also includes the steps of disposing a second planar conductor on top of a formation of light emitting chips so that the second planar conductor is in contact with the other of the cathode and anode of each chip; and binding the first planar conductor to the second planar conductor to permanently maintain the formation of light emitting chips without the use of solder or wiring bonding for making an electrical and mechanical contact between the chips and either of the first planar conductor and the second planar conductor.

Claims

1. A method of making a photo-radiation source to emit light in a photo-radiation spectrum, the method comprising:

providing a first planar conductor;

disposing a formation of light emitting chips on the first planar conductor, each chip having a cathode and an anode, one of the cathode and anode of each chip being in contact with the first planar conductor;

disposing a second planar conductor on top of the formation of light emitting chips so that the second planar conductor is in contact with the other of the cathode and anode of each respective chip; and

binding the first planar conductor to the second planar conductor to permanently maintain the formation of light emitting chips without the use of solder or wiring bonding for making an electrical and mechanical contact between the chips and either of the first planar conductor and the second planar conductor, wherein the binder comprises a charge transport matrix material.

2. The method of claim 1, wherein the charge-transport matrix material comprises an ionic transport material.

3. The method of claim 2;

wherein the ionic transport material comprises an electrolyte.

4. The method of claim 3;

wherein the electrolyte is a solid polymer electrolyte.

5. The method of claim 4;

where the solid polymer electrolyte comprises a polymer electrolyte including at least one of a polyethylene glycol, a polyethylene oxide, and a polyethylene sulfide.

6. The method of claim 1;

wherein the charge-transport matrix material comprises an intrinsically conductive polymer.

7. The method of claim 6;

wherein the intrinsically conductive polymer comprises aromatic repeat units in a polymer backbone.

8. The method of claim 1;

wherein the intrinsically conductive polymer comprises a polythiophene.

9. The method of claim 8;

wherein the photo-radiation spectrum comprises a range between and including UV and blue light.

10. The method of claim 8;

wherein the photo-radiation spectrum comprises a range between and including 365 and 405 nm.

11. The method of claim 8;

wherein the photo-radiation spectrum comprises a range including 420 nm.

12. The method of claim 9;

wherein the photo-radiation spectrum comprises a range between and including 365 and 405 nm.

13. The method of claim 9;

wherein the photo-radiation spectrum comprises a range including 420 nm.

14. The method of claim 1;

wherein the charge-transport matrix material is transparent to photo-radiation in a photo-radiation spectrum effective for the selective polymerization of a photo-radiation-curable organic material.

15. The method of claim 14;

wherein the photo-radiation spectrum comprises a range between and including UV and blue light.

16. The method of claim 1;

wherein the photo-radiation spectrum comprises a range between and including 365 and 405 nm.

17. The method of claim 1;

wherein the photo-radiation spectrum comprises a range including 420 nm.

18. The method of claim 1;

wherein at least one of the first electrode and the second electrode is transparent to photo-radiation in a photo-radiation spectrum effective for the selective polymerization of a photo-radiation-curable organic material.

19. The method of claim 1;

wherein the first planar conductor and the second planar conductor are disposed on flexible substrates.

20. The method of claim 1;

wherein the charge transport material is effective for transporting electrical charges to the light emitting chip when a voltage is applied to the first electrode and the second electrode, said charges being effective for causing the emission of photo-radiation from the light emitting chip.

21. The method of claim 1;

wherein the light emitting chip are capable of emitting photo-radiation in a photo-radiation spectrum effective for the selective polymerization of a photo-radiation-curable organic material.

22. The method of claim 1;

wherein one of the first and the second planar conductors is transparent to at least of portion of photo-radiation emitted by the light emitting chip and the other of the first and the second planar conductors is reflective of said at least a portion of the photo-radiation emitted by the light emitting chip.

23. The method of claim 1;

wherein the light emitting chip comprises an organic light active particulate including at least one conjugated polymer, said at least one conjugated polymer having a sufficiently low concentration of extrinsic charge carriers so that on applying an electric field between the first and second planar conductors to the light emitting chip through the charge transport matrix material the second planar conductor becomes positive relative to the first planar conductor and charge carriers are injected into the light emitting chip and combine to form in the conjugated polymer charge carrier pairs which decay radiatively so that radiation is emitted from the conjugated polymer.

24. The method of claim 23;

wherein the organic light active particulate comprises particles including at least one of hole transport material, organic emitters, and electron transport material.

25. The method of claim 23;

wherein the organic light active particulate comprises particles including a polymer blend, the polymer blend including an organic emitter blended with at least one of a hole transport material, an electron transport material and a blocking material.

26. The method of claim 25;

wherein the organic light active particulate comprises microcapsules including a polymer shell encapsulating an internal phase comprised of a polymer blend including an organic emitter blended with at least one of a hole transport material, an electron transport material and a blocking material.

27. The method of claim 25;

wherein the charge transport matrix comprises a binder material with one or more characteristic controlling additives.

28. The method of claim 27;

wherein the characteristic controlling additives are at least one of a particulate and a fluid include a desiccant;

a conductive phase, a semiconductor phase, an insulative phase, a mechanical strength enhancing phase, an adhesive enhancing phase, a hole injecting material, an electron injecting material, a low work metal, a blocking material, and an emission enhancing material.