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Flexible substrate with electronic devices formed thereon

  • US 7,678,701 B2
  • Filed: 07/31/2006
  • Issued: 03/16/2010
  • Est. Priority Date: 07/31/2006
  • Status: Expired due to Fees
First Claim
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1. A method of manufacturing an electronic device comprising:

  • a) providing a substrate that comprises at least one plastic material;

    b) embedding a particulate material in at least one surface of the substrate;

    c) forming a thin film electronic device on said surface with said particulate material; and

    further comprising;

    d) embedding the particulate material in a second surface of the substrate; and

    e) forming a thin film electronic device on said second surface having said embedded particulate material.

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