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Circuit board manufacturing method and circuit board

  • US 7,679,004 B2
  • Filed: 03/02/2005
  • Issued: 03/16/2010
  • Est. Priority Date: 03/03/2004
  • Status: Expired due to Fees
First Claim
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1. A circuit board in which a circuit portion is formed on an insulating substrate by a conductive layer and there provided a through hole and/or a non-through hole having an internal wall covered or filled with the conductive layer, wherein a land of the through hole and/or the non-through hole is formed continuously like a concentric circle with respect to the hole, a maximum height of the conductive layer in a non-coupling portion of the land is equal to or greater than −

  • 5 μ

    m with a corner portion of the insulating substrate set to be a reference point and is equal to or smaller than a thickness of the conductive layer in a circuit portion, and a land width from the reference point is 0 to 40 μ

    m,wherein the land width falls between a maximum value and a minimum value, and wherein a difference between the maximum and minimum values is equal to or less than 8 μ

    m and greater than 0 μ

    m.

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