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Substrate structures and fabrication methods thereof

  • US 7,679,081 B2
  • Filed: 01/22/2007
  • Issued: 03/16/2010
  • Est. Priority Date: 08/29/2006
  • Status: Active Grant
First Claim
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1. A substrate structure, comprising:

  • a bendable substrate;

    an inorganic electrode structure transferred from a transferring substrate onto the bendable substrate such that the inorganic electrode structure is indented into the bendable substrate, and a top surface of the inorganic electrode is level with a top surface of the bendable substrate;

    a plurality of auxiliary electrodes on the bendable substrate and adhered with the inorganic electrode structure; and

    a structural layer disposed on the inorganic electrode structure and between the auxiliary electrodes, wherein a top surface of the structural layer is coplanar with top surfaces of the auxiliary electrodes,wherein the inorganic electrode structure comprises a conductive layer or a semiconductor layer, andwherein the bendable substrate comprises polyethylene (PE), polyimide (PI), polyvinyl alcohol (PVA), or polymethyl methacrylate (PMMA).

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