Integrated current sensor package

• US 7,679,162 B2
• Filed: 12/19/2005
• Issued: 03/16/2010
• Est. Priority Date: 12/19/2005
• Status: Active Grant

• Current Assignee: Silicon Laboratories Incorporated
• Original Assignee: Silicon Laboratories Incorporated
• Inventors: Pavelka, John, Dupuis, Timothy J.
• Primary Examiner(s): Soward; Ida M
• Application Number:
  US11/311,517
• Publication Number:
  US 20070139066A1
• Time in Patent Office: 1,548 Days
• Field of Search: 257/531, 257/678, 257/726, 257/E21.022, 257/724, 257/904, 257/924
• US Class Current: 257/531
• CPC Class Codes: G01R 15/181 using coils without a magnetic core, e.g. Rogowski coils
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4826 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: Y10S 257/904 with passive components,, e.g. polysilicon resistors
• CPC Class Codes: Y10S 257/924 with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap

Abstract

An integrated current sensor package includes an integrated circuit having a coil in a metal layer of the circuit. A wire is placed close enough to the coil such that the coil and the wire are inductively coupled with each other.

Claims

1. A current sensor, comprising:

an integrated circuit die including a coil in a metal layer of the integrated circuit die;

an integrated circuit die package to hold the integrated circuit die; and

a conductor located within the integrated circuit die package and outside of the integrated circuit die, and coupled to receive a current from one or more input terminals of the integrated circuit die package and supply the current to one or more output terminals of the integrated circuit die package, the conductor located such that the coil and the conductor are inductively coupled; and

wherein at least a first region of the conductor is parallel to a horizontal surface of the integrated circuit die and the first region of the conductor is longer than a width of the coil and at least a portion of the first region of the conductor overlaps a portion of the coil.

2. The current sensor of claim 1, wherein the coil is located in a top metal layer of the integrated circuit die.

3. The current sensor of claim 1, wherein the conductor is located on top of the integrated circuit die.

4. The current sensor of claim 1, wherein the conductor comprises copper.

5. The current sensor of claim 1, wherein the conductor is offset from a center of the coil, and at least one half of the coil is non-overlapped by the conductor.

6. The apparatus as recited in claim 1 further comprising a first and second plurality of bond wires coupled to the conductor, the first plurality of bond wires coupled to supply the conductor with the current and the second plurality of bond wires coupled to receive the current from the conductor.

7. The current sensor of claim 1, further including a lead frame for supporting the integrated circuit die in an inverted position above the conductor.

8. The current sensor of claim 7, wherein the lead frame is connected to the inverted integrated circuit die by solder balls.

9. A current sensor, comprising:

a first area of an integrated circuit die containing functional circuitry, the functional circuitry contained in a substrate of the integrated circuit die;

a second area of the integrated circuit die containing an inductor for detecting a current, wherein the inductor comprises a coil in a metal layer of the integrated circuit die;

a conductor located in an integrated circuit package housing the integrated circuit die;

wherein the conductor is coupled to receive a current from one or more input terminals of the integrated circuit die package and to supply the current to one or more output terminals of the integrated circuit die package, the conductor located such that the inductor and the conductor are inductively coupled; and

wherein at least a first region of the conductor is parallel to a horizontal surface of the integrated circuit die and the first region of the conductor is longer than a width of the inductor and at least a portion of the first region of the conductor overlaps a portion of the inductor.

10. The current sensor of claim 9, wherein the coil is located in the top metal layer of the integrated circuit.

11. The current sensor of claim 9 wherein the conductor is formed of copper.

12. A current sensor, comprising:

a first area of an integrated circuit containing functional circuitry, the functional circuitry contained in a substrate of the integrated circuit;

a second area of the integrated circuit containing an inductor for detecting a current, wherein the inductor comprises a coil in a metal layer of the integrated circuit; and

a conductor located in an integrated circuit package housing the integrated circuit, the conductor placed close enough to the coil such that the coil and the conductor are inductively coupled with each other, wherein the conductor overlaps only a first portion of the coil to enable an induced current within the coil responsive to a current in the conductor; and

further including a lead frame for supporting the integrated circuit in an inverted position above the conductor.

13. The current sensor of claim 12, wherein the lead frame is connected to the inverted integrated circuit by solder balls.

14. A method for forming a current sensor comprising:

forming a conductor in an integrated circuit package for housing an integrated circuit die having an inductor, the conductor for carrying current to be sensed, wherein the conductor is disposed with respect to the inductor so as to be inductively coupled to enable a current in the conductor to be measured in the integrated circuit die, the conductor being formed so as to receive a current from one or more input terminals of the integrated circuit die package and to supply the current to one or more output terminals of the integrated circuit die package, and wherein at least a first region of the conductor is formed parallel to a horizontal surface of the integrated circuit die and the first region of the conductor is longer than a width of the inductor and at least a portion of the first region of the conductor is formed so as to overlap a portion of the inductor.

15. The method as recited in claim 14 wherein the conductor is formed of copper.

16. The method as recited in claim 14 wherein the conductor is formed so as to be capable of carrying up to about 10 amps of current.

17. A current sensor, comprising:

an integrated circuit die including a metal coil in a layer of the integrated circuit die;

an integrated circuit die package to hold the integrated circuit die; and

a conductor located within the integrated circuit die package and outside of the integrated circuit die, and coupled to receive a current from one or more input terminals of the integrated circuit die package and supply the current to one or more output terminals of the integrated circuit die package, the conductor and the metal coil being inductively coupled; and

wherein at least a first region of the conductor is parallel to a horizontal surface of the integrated circuit die and the first region of the conductor is longer than a width of the metal coil and at least a portion of the first region of the conductor overlaps a portion of the metal coil.