Integrated current sensor package
First Claim
Patent Images
1. A current sensor, comprising:
- an integrated circuit die including a coil in a metal layer of the integrated circuit die;
an integrated circuit die package to hold the integrated circuit die; and
a conductor located within the integrated circuit die package and outside of the integrated circuit die, and coupled to receive a current from one or more input terminals of the integrated circuit die package and supply the current to one or more output terminals of the integrated circuit die package, the conductor located such that the coil and the conductor are inductively coupled; and
wherein at least a first region of the conductor is parallel to a horizontal surface of the integrated circuit die and the first region of the conductor is longer than a width of the coil and at least a portion of the first region of the conductor overlaps a portion of the coil.
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Abstract
An integrated current sensor package includes an integrated circuit having a coil in a metal layer of the circuit. A wire is placed close enough to the coil such that the coil and the wire are inductively coupled with each other.
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Citations
17 Claims
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1. A current sensor, comprising:
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an integrated circuit die including a coil in a metal layer of the integrated circuit die; an integrated circuit die package to hold the integrated circuit die; and a conductor located within the integrated circuit die package and outside of the integrated circuit die, and coupled to receive a current from one or more input terminals of the integrated circuit die package and supply the current to one or more output terminals of the integrated circuit die package, the conductor located such that the coil and the conductor are inductively coupled; and wherein at least a first region of the conductor is parallel to a horizontal surface of the integrated circuit die and the first region of the conductor is longer than a width of the coil and at least a portion of the first region of the conductor overlaps a portion of the coil. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A current sensor, comprising:
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a first area of an integrated circuit die containing functional circuitry, the functional circuitry contained in a substrate of the integrated circuit die; a second area of the integrated circuit die containing an inductor for detecting a current, wherein the inductor comprises a coil in a metal layer of the integrated circuit die; a conductor located in an integrated circuit package housing the integrated circuit die; wherein the conductor is coupled to receive a current from one or more input terminals of the integrated circuit die package and to supply the current to one or more output terminals of the integrated circuit die package, the conductor located such that the inductor and the conductor are inductively coupled; and wherein at least a first region of the conductor is parallel to a horizontal surface of the integrated circuit die and the first region of the conductor is longer than a width of the inductor and at least a portion of the first region of the conductor overlaps a portion of the inductor. - View Dependent Claims (10, 11)
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12. A current sensor, comprising:
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a first area of an integrated circuit containing functional circuitry, the functional circuitry contained in a substrate of the integrated circuit; a second area of the integrated circuit containing an inductor for detecting a current, wherein the inductor comprises a coil in a metal layer of the integrated circuit; and a conductor located in an integrated circuit package housing the integrated circuit, the conductor placed close enough to the coil such that the coil and the conductor are inductively coupled with each other, wherein the conductor overlaps only a first portion of the coil to enable an induced current within the coil responsive to a current in the conductor; and further including a lead frame for supporting the integrated circuit in an inverted position above the conductor. - View Dependent Claims (13)
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14. A method for forming a current sensor comprising:
forming a conductor in an integrated circuit package for housing an integrated circuit die having an inductor, the conductor for carrying current to be sensed, wherein the conductor is disposed with respect to the inductor so as to be inductively coupled to enable a current in the conductor to be measured in the integrated circuit die, the conductor being formed so as to receive a current from one or more input terminals of the integrated circuit die package and to supply the current to one or more output terminals of the integrated circuit die package, and wherein at least a first region of the conductor is formed parallel to a horizontal surface of the integrated circuit die and the first region of the conductor is longer than a width of the inductor and at least a portion of the first region of the conductor is formed so as to overlap a portion of the inductor. - View Dependent Claims (15, 16)
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17. A current sensor, comprising:
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an integrated circuit die including a metal coil in a layer of the integrated circuit die; an integrated circuit die package to hold the integrated circuit die; and a conductor located within the integrated circuit die package and outside of the integrated circuit die, and coupled to receive a current from one or more input terminals of the integrated circuit die package and supply the current to one or more output terminals of the integrated circuit die package, the conductor and the metal coil being inductively coupled; and wherein at least a first region of the conductor is parallel to a horizontal surface of the integrated circuit die and the first region of the conductor is longer than a width of the metal coil and at least a portion of the first region of the conductor overlaps a portion of the metal coil.
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Specification