Microprocessor die with integrated voltage regulation control circuit

• US 7,679,344 B2
• Filed: 06/08/2007
• Issued: 03/16/2010
• Est. Priority Date: 03/08/2004
• Status: Active Grant

• Current Assignee: Tahoe Research Limited (f/k/a Learndale Limited) (Vector Capital Corporation)
• Original Assignee: Intel Corporation
• Inventors: Carlson, Jeffrey A., Osburn, Edward P.
• Primary Examiner(s): Patel; Rajnikant B
• Application Number:
  US11/760,225
• Publication Number:
  US 20070229043A1
• Time in Patent Office: 1,012 Days
• Field of Search: 323282-288, 323/351, 323/272, 323/265, 323/268, 713/300, 713/310, 713/320, 713/322, 361/502, 363/26, 363/89, 363/128
• US Class Current: 323/272
• CPC Class Codes: G06F 1/26 Power supply means, e.g. regulation thereof for memories G11C

Abstract

An integrated circuit die includes a microprocessor and a control circuit to control elements of a voltage regulator to supply power to the microprocessor.

Claims

1. An integrated circuit (IC) die, comprising:

a microprocessor; and

a control circuit to control elements of a voltage regulator to supply power to the microprocessor;

wherein;

the control circuit includes a plurality of sensors,

the microprocessor includes a plurality of sensor locations in the microprocessor,

one or more of the sensors are located at each of said sensor locations in the microprocessor; and

one or more of said sensors at said plurality of sensor locations are for reading one or more buffers and/or registers of the microprocessor.

2. The IC die of claim 1, wherein at least some of the sensors are analog sensors.

3. The IC die of claim 2, wherein some of the sensors are digital sensors.

4. The IC die of claim 1, wherein at least some of the sensors are digital sensors.

5. The IC die of claim 1, wherein the control circuit is laid out in accordance with an analog architecture.

6. The IC die of claim 1, wherein the control circuit is laid out in accordance with a digital architecture.

7. The IC die of claim 6, wherein the control circuit includes a core to execute instructions.

8. The IC die of claim 6, wherein the control circuit includes an arithmetic logic block.

9. The IC die of claim 6, wherein the control circuit includes a timer block.

10. The IC die of claim 6, wherein the control circuit includes an output driving block.

11. The IC die of claim 6, wherein the control circuit includes a fuse block.

17. The IC die of claim 1, wherein at least one of the sensors detects a voltage condition at at least one of said sensor locations in the microprocessor.

18. The IC die of claim 1, wherein at least one of the sensors detects an electrical current condition at at least one of said sensor locations in the microprocessor.

19. The IC die of claim 1, wherein at least one of the sensors detects a thermal condition at at least one of said sensor locations in the microprocessor.

20. The IC die of claim 1, wherein at least one of the sensors detects a microprocessor activity condition at at least one of said sensor locations in the microprocessor.

12. A system comprising:

an IC die which includes a microprocessor and a control circuit for a voltage regulator; and

a plurality of power phase circuits, each of the power phase circuits including;

a pair of field effect transistors (FETs) coupled in series between a power terminal and ground;

an inductor coupled to a node at which the FETs are coupled to each other; and

at least one driver coupled to the control circuit to receive a control signal from the control circuit, the at least one driver also coupled to at least one of the FETs to selectively activate the FETs;

wherein;

the control circuit includes a plurality of sensors,

the microprocessor includes a plurality of sensor locations in the microprocessor,

one or more of the sensors are located at each of said sensor locations in the microprocessor; and

one or more of said sensors at said plurality of sensor locations are for reading one or more buffers and/or registers of the microprocessor.

14. The system of claim 12, further comprising a voltage converter coupled to the control circuit to supply power to the control circuit.

15. The system of claim 12, further comprising at least one capacitor coupled between the inductors and ground.

21. The system of claim 12, further comprising a voltage converter coupled to the control circuit to supply power to the control circuit, said voltage converter separate from said power phase circuits.

13. A system comprising:

a die comprising a microprocessor; and

a chipset in communication with the microprocessor;

wherein the die includes a control circuit to control elements of a voltage regulator to supply power to the microprocessor;

wherein;

the control circuit includes a plurality of sensors,

the microprocessor includes a plurality of sensor locations in the microprocessor,

one or more of the sensors are located at each of said sensor locations in the microprocessor; and

one or more of said sensors at said plurality of sensor locations are for reading one or more buffers and/or registers of the microprocessor.

16. The system of claim 13, further comprising a voltage converter coupled to the control circuit to supply power to the control circuit, said voltage converter separate from said voltage regulator.