Cantilever microprobes for contacting electronic components and methods for making such probes

• US 7,679,388 B2
• Filed: 04/02/2007
• Issued: 03/16/2010
• Est. Priority Date: 02/04/2003
• Status: Expired due to Fees

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Smalley, Dennis R., Bang, Christopher A., Kruglick, Ezekiel J. J., Chen, Richard T., Lembrikov, Pavel B.
• Primary Examiner(s): TANG, MINH NHUT
• Application Number:
  US11/695,597
• Publication Number:
  US 20070170940A1
• Time in Patent Office: 1,079 Days
• Field of Search: None
• US Class Current: 324/755.07
• CPC Class Codes: C25D 5/02 Electroplating of selected surface areas
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: G01R 1/06738 related to tip portion
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 1/06755 Material aspects
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07357 with flexible bodies, e.g. buckling beams
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

Claims

1. A probe device for contacting an electronic component, comprising:

a base element for mounting to a laterally extending surface of a substrate;

at least one post element having a proximal end attached to the base element and having a distal end;

a composite beam element, comprising at least two vertically spaced laterally extending beams, each beam having a distal end and a proximal end, wherein the proximal end of each beam is attached to the at least one post element, and wherein the distal end of each beam is attached to a bridge element; and

a contact element, comprising a laterally extending cantilever portion and a vertically extending portion defining a contact tip, wherein the laterally extending cantilever portion has a proximal end connected to the bridge element and a distal end to which the vertically extending portion connects.

2. The probe device of claim 1 wherein the laterally extending cantilever portion is thinner than any of the laterally extending beams.

3. The probe device of claim 1 wherein the laterally extending cantilever portion is narrower than any of the laterally extending beams.

4. The probe device of claim 1 wherein the laterally extending cantilever portion is shorter in lateral extension than any of the laterally extending beams and wherein the connection between the laterally extending cantilever portion and the bridge element occurs at a position that is vertically beyond the at least two laterally extending beams of the composite beam element and wherein the distal end of the cantilever beam element extends laterally beyond the bridge element away from the at least one post element.

5. The probe device of claim 1 wherein the laterally extending cantilever portion is defined by a layer of deposited material and wherein the cantilever beam elements are each defined by one or more layers of deposited material, wherein the layer of deposited material defining the laterally extending cantilever portion is thinner than the layer or layers defining each beam.

6. The probe of claim 1 wherein the probe is fabricated from a plurality of adhered layers wherein at least portions of the base element and the composite beam element are formed from one or more commonly deposited layers of material.

7. The probe of claim 1 wherein the base element has an elongated configuration that has a lateral extent that extends under the composite beam element.

8. A probe device for contacting an electronic component, comprising:

a base element for mounting to a laterally extending surface of a substrate;

at least one post element having a proximal end attached to the base element and having a distal end;

a cantilever beam element having a distal end and a proximal end, wherein the proximal end of the cantilever beam element is attached to the at least one post element; and

a contact element, comprising a laterally extending cantilever portion and a vertically extending portion defining a contact tip, wherein the laterally extending cantilever portion has a proximal end connected directly or indirectly to the cantilever beam and a distal end to which the vertically, extending portion connects.

9. The probe device of claim 8 wherein the laterally extending cantilever portion is thinner than any of the cantilever beam element.

10. The probe device of claim 8 wherein the laterally extending cantilever portion is narrower than the cantilever beam element.

11. The probe device of claim 8 wherein the laterally extending cantilever portion is shorter in length than the cantilever beam element and wherein the connection between the laterally extending cantilever portion and the cantilever beam element occurs via a vertical extension that positions the laterally extending cantilever portion vertically beyond the cantilever beam and wherein the distal end of the laterally extending cantilever portion extends laterally beyond the respective cantilever beams away from the respective post elements.

12. The probe device of claim 8 wherein the laterally extending cantilever portion is defined by a layer of deposited material and wherein the cantilever beam element is defined by one or more layers of deposited material, wherein the layer of deposited material defining the laterally extending cantilever portion is thinner than the layer or layers defining the cantilever beam element.

13. The probe of claim 8 wherein the probe is fabricated from a plurality of adhered layers wherein at least portions of the base element and the cantilever beam element are formed from one or more commonly deposited layers of material.

14. The probe of claim 8 wherein the base element has an elongated configuration that has a lateral extent that extends under the cantilever beam element.

15. An array of probes for contacting a plurality of pads of an electronic component, comprising:

(a) a plurality of elongated probes mounted to and extending above a substrate wherein each probe has a contact tip and an orientation and wherein the contact tips of the plurality of probes have a desired configuration, wherein each of the plurality of elongated probes, comprises;

(i) a base element for mounting to a laterally extending surface of a substrate;

(ii) at least one post element having a proximal end attached to the base element and having a distal end;

(iii) a cantilever beam element having a distal end and a proximal end, wherein the proximal end of the cantilever beam element is attached to the at least one post element; and

(iv) a contact element, comprising a laterally extending cantilever portion and a vertically extending portion defining a contact tip, wherein the laterally extending cantilever portion has a proximal end connected directly or indirectly to the cantilever beam and a distal end to which the vertically extending portion connects; and

wherein the configuration of the contact tips of at least a portion of the plurality of elongated probes define a line and wherein successive elongated probes whose contact tips are along the line have reversed orientations such that a pitch of the contact tips along the line is tighter than a pitch of adjacent probes having a similar orientations.

16. The probe array of claim 15 wherein the laterally extending cantilever portions of the plurality of elongated probes is thinner than any of the cantilever beam element.

17. The probe array of claim 15 wherein the laterally extending cantilever portions of the plurality of elongated probes are narrower than any of the cantilever beam elements.

18. The probe array of claim 15 wherein the laterally extending cantilever portions of the plurality of elongated probes are shorter in length than any of the cantilever beam elements and wherein the connection between the laterally extending cantilever portions and the respective cantilever beam elements occur via a vertical extensions that position the laterally extending cantilever portions vertically beyond the respective cantilever beams and wherein the distal end of the laterally extending cantilever portions extend laterally beyond the respective cantilever beams away from the respective post elements.

19. The probe array of claim 15 wherein the laterally extending cantilever portions of the plurality of elongated probes are defined by a layer of deposited material and wherein the cantilever beam elements are each defined by one or more layers of deposited material, wherein the layer of deposited material defining the cantilever portion is thinner than the layer or layers defining the cantilever beam elements.

20. The probe of claim 15 wherein the probes are fabricated from a plurality of adhered layers wherein at least portions of the base elements and the respective cantilever beam elements are formed from one or more commonly deposited layers of material.

21. The probe of claim 15 wherein the base elements have elongated configurations that have lateral extents that extend under the respective cantilever beam elements.