Camera module package

• US 7,679,669 B2
• Filed: 04/05/2007
• Issued: 03/16/2010
• Est. Priority Date: 05/18/2006
• Status: Expired due to Fees

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Kwak, Hyung Chan
• Primary Examiner(s): HO, TUAN V
• Application Number:
  US11/783,054
• Publication Number:
  US 20070268399A1
• Time in Patent Office: 1,076 Days
• Field of Search: 348/340, 348373-375
• US Class Current: 348/340
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence

Abstract

A camera module package comprises an image sensor having a light receiving section formed in the central portion of the upper surface thereof and a plurality of bumps formed around the light receiving section; an FPCB that is closely bonded to the image sensor by a flip chip, the FPCB having a plurality of via holes perforated at bonding positions corresponding to the bumps such that the bumps and the via holes are closely bonded to each other one to one; and an optical unit having a housing received on the FPCB and a lens barrel screwed to the central portion of the housing.

Claims

1. A camera module package comprising:

an image sensor having a light receiving section formed in the central portion of the upper surface thereof and a plurality of bumps formed around the light receiving section;

flexible printed circuit board (FPCB) that is closely bonded to the image sensor by a flip chip, the FPCB having a plurality of via holes perforated at bonding positions corresponding to the bumps such that the bumps and the via holes are closely bonded to each other one to one; and

an optical unit having a housing received on the FPCB and a lens barrel screwed to the central portion of the housing,

wherein the via hole has a metallic film formed on the inner surface thereof, the metallic film being composed of an Au (gold) or Sn (tin) plated layer, and

a via land is formed around the via hole by patterning which is performed toward the outside of the metallic film.

2. The camera module package according to claim 1,

wherein the FPCB and the image sensor are bonded and fixed to each other, with an anisotropic conductive film (ACF) or non-conductive paste (NCP) being interposed in the bonding portion between the via hole and the bump.

3. The camera module package according to claim 1,

wherein the via holes are composed of through-holes which vertically pass through the FPCB.

4. The camera module package according to claim 1,

wherein the housing has an infrared (IR)-cut filter closely mounted on the upper surface of the FPCB.

5. The camera module package according to claim 1,

wherein the housing is received on the upper surface of the FPCB in a state where an IR-cut filter is attached on the bottom surface of the housing.

7. The camera module package according to claim 1,

wherein the bump is manufactured in a plated-bump shape or stud-bump shape.

6. The camera module package according to claim,

wherein the FPCB is a double-sided FPCB.