Electronic controller

• US 7,679,914 B2
• Filed: 09/21/2007
• Issued: 03/16/2010
• Est. Priority Date: 09/26/2006
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Kashiwazaki, Atsushi
• Primary Examiner(s): Gandhi; Jayprakash N
• Assistant Examiner(s): HOFFBERG, ROBERT JOSEPH
• Application Number:
  US11/902,379
• Publication Number:
  US 20080074829A1
• Time in Patent Office: 907 Days
• Field of Search: 361/704, 361/707, 361/718, 361/722, 361/723, 257/667, 257/675, 257711-712, 257/719
• US Class Current: 361/714
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49531 the additional leads being a wiring board
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H05K 1/0203 : Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/167 : incorporating printed resistors
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/09745 : Recess in conductor, e.g. in pad or in metallic substrate
• CPC Class Codes: H05K 2201/1034 : Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
• CPC Class Codes: H05K 2201/1056 : Metal over component, i.e. metal plate over component mounted on or embedded in PCB
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2201/10924 : Leads formed from a punched metal foil
• CPC Class Codes: H05K 2203/049 : Wire bonding
• CPC Class Codes: H05K 2203/1572 : Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: H05K 3/0061 : onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

An electronic controller having a circuit board with an element disposed thereon, a base member with the circuit board adhered thereon and a lead terminal in an electrical connection with the circuit board includes as the elements thick film resistors and electric components soldered by solder on a bottom side of the circuit board, and also includes electronic components including bare chips being at least wired without soldering on a top surface of the circuit board. The electronic controller has a first concave portion at a position corresponding to a position of the components on a surface that has the circuit board of the base member adhered thereon, and the circuit board is molded by a sealing resin so as to expose a portion of the base member and a portion of the lead terminal.

Claims

1. An electronic controller comprising:

a circuit board that has an element mounted thereon for composing a circuit;

a base member that has the circuit board adhesively fixed thereon; and

an external terminal that is electrically connected to the circuit board,

wherein a base member facing side of the circuit board that is adhered to the base member has as the element a thick film resistor disposed thereon and an electronic component that is mounted thereon by soldering,

a reverse side of the circuit board that opposes the base member facing side to be adhered to the circuit board has as the element an electronic component that includes a bare-chip that is at least connected by wire for mounting without soldering,

a first side of the base member that has the circuit board adhered thereto has a first concave portion at a position that corresponds to the electronic component being mounted on the circuit board,

the circuit board is molded with a part of the base member and a part of the external terminal respectively being exposed from molding, and

the first concave portion has in a planar direction of the circuit board at least one of an end that has an opening on an end surface of the base member and a portion that extends out of a disposition area of the circuit board on the base member.

2. The electronic controller of claim 1,

the circuit board has a thick film resistor disposition and an electronic component disposition area on a side that is adhered to the base member, and

the base member has one piece of the first concave portion in correspondence to a plurality of the electronic components.