Method of processing substrate, and method of and program for manufacturing electronic device
First Claim
1. A method of processing a substrate having a carbon-containing low dielectric constant insulating film thereon, the low dielectric constant insulating film having a surface damaged layer having a reduced carbon concentration lower than a carbon concentration of the low dielectric constant insulating film, the method removing the surface damage layer of the low dielectric constant insulating film and comprising:
- a surface damaged layer exposure step of exposing the surface damaged layer to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure; and
a surface damaged layer heating step of heating to a predetermined temperature the surface damaged layer that has been exposed to the atmosphere of the mixed gas.
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Accused Products
Abstract
A method of processing a substrate that enables the amount removed of a surface damaged layer to be controlled easily, and enable a decrease in wiring reliability to be prevented. A surface damaged layer having a reduced carbon concentration of a carbon-containing low dielectric constant insulating film on a substrate is exposed to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure. The surface damaged layer that has been exposed to the atmosphere of the mixed gas is heated to a predetermined temperature.
18 Citations
12 Claims
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1. A method of processing a substrate having a carbon-containing low dielectric constant insulating film thereon, the low dielectric constant insulating film having a surface damaged layer having a reduced carbon concentration lower than a carbon concentration of the low dielectric constant insulating film, the method removing the surface damage layer of the low dielectric constant insulating film and comprising:
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a surface damaged layer exposure step of exposing the surface damaged layer to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure; and a surface damaged layer heating step of heating to a predetermined temperature the surface damaged layer that has been exposed to the atmosphere of the mixed gas. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of processing a substrate having thereon a mask film comprising at least one of a photoresist film and a hard mask film, the mask film having a surface damaged layer, the method removing the surface damaged layer of the mask film and comprising:
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a surface damaged layer exposure step of exposing the surface damaged layer to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure; and a surface damaged layer heating step of heating to a predetermined temperature the surface damaged layer that has been exposed to the atmosphere of the mixed gas.
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8. A method of manufacturing an electronic device, comprising:
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a low dielectric constant insulating film formation step of forming a carbon-containing low dielectric constant insulating film on a capacitor comprising a lower electrode, a capacitive insulating film and an upper electrode that has been formed on a semiconductor substrate; a photoresist layer formation step of forming a photoresist layer in a predetermined pattern on the formed low dielectric constant insulating film; a plasma fabrication step of fabricating a connecting hole reaching the upper electrode in the low dielectric constant insulating film by plasma processing using the formed photoresist layer; a connecting hole surface exposure step of exposing a surface of the fabricated connecting hole to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure; and a connecting hole surface heating step of heating to a predetermined temperature the surface of the connecting hole that has been exposed to the atmosphere of the mixed gas.
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9. A method of manufacturing an electronic device, comprising:
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an interlayer insulating film formation step of forming a carbon-containing low dielectric constant insulating film on a semiconductor substrate, and forming an other insulating film having a lower carbon concentration than the low dielectric constant insulating film on the low dielectric constant insulating film, so as to form an interlayer insulating film; a plasma fabrication step of fabricating a wiring groove in the interlayer insulating film by plasma processing; a wiring groove surface exposure step of exposing at least a surface of the wiring groove at the low dielectric constant insulating film to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure; a wiring groove surface heating step of heating to a predetermined temperature the surface of the wiring groove that has been exposed to the atmosphere of the mixed gas;
an other insulating film removal step of removing the other insulating film; anda wiring formation step of forming wiring by introducing a conductive material into the wiring groove. - View Dependent Claims (10)
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11. A method of manufacturing an electronic device, comprising:
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a conductive film formation step of forming a silicon-containing conductive film on a semiconductor substrate; a low dielectric constant insulating film formation step of forming a carbon-containing low dielectric constant insulating film on the formed conductive film; a photoresist layer formation step of forming a photoresist layer in a predetermined pattern on the formed low dielectric constant insulating film; a plasma fabrication step of fabricating a connecting hole reaching the conductive film in the low dielectric constant insulating film by plasma processing using the formed photoresist layer; a connecting hole surface exposure step of exposing a surface of the fabricated connecting hole to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure; a connecting hole surface heating step of heating to a predetermined temperature the surface of the connecting hole that has been exposed to the atmosphere of the mixed gas; an ashing step of removing the photoresist layer; and
a wiring formation step of forming wiring by introducing a conductive material into the connecting hole.
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12. A method of manufacturing an electronic device, comprising:
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a conductive film formation step of forming a silicon-containing conductive film on a semiconductor substrate; a low dielectric constant insulating film formation step of forming a silicon-containing low dielectric constant insulating film on the formed conductive film; an anti-reflection film formation step of forming an anti-reflection film on the formed low dielectric constant insulating film; a photoresist layer formation step of forming a photoresist layer having a pattern corresponding to a desired gate shape on the formed anti-reflection film; an anti-reflection film removal step of removing partially the anti-reflection film through etching by using the formed photoresist layer to expose the low dielectric constant insulating film; a low dielectric constant insulating film removal step of removing the exposed low dielectric constant insulating film by plasma processing using the formed photoresist layer to expose the conductive film; a low dielectric constant insulating film side surfaces exposure step of exposing side surfaces of a part of the low dielectric constant insulating film below the photoresist layer, which has not been removed in said low dielectric constant insulating film removal step, to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure; a low dielectric constant insulating film side surfaces heating step of heating to a predetermined temperature the side surfaces of the part of the low dielectric constant insulating film which has been exposed to the atmosphere of the mixed gas; and a conductive film removal step of removing through etching the conductive film not being covered with the part of the low dielectric constant insulating film which has not been removed.
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Specification