Thermal management materials having a phase change dispersion
First Claim
1. A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween, said interface comprising a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface, said compound comprising an admixture of:
- (a) a polymeric constituent forming a continuous matrix in said layer, said matrix being form-stable at normal room temperature in a first matrix phase and conformable between the first and second heat transfer surface in a second matrix phase, and said matrix having a matrix melting or glass transition temperature above normal room temperature from said first matrix phase to said second matrix phase; and
(b) a dispersed constituent forming discrete domains within said matrix, said domains being form-stable at normal room temperature in a first domain phase and conformable between the first and second heat transfer surface in a second domain phase, and said domains having a domain melting temperature above normal room temperature from said first domain phase to said second domain phase, said domain melting temperature being between about 40-80°
C.
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Abstract
A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a polymeric constituent forming a continuous matrix in the layer; and (b) a dispersed constituent forming discrete domains within the matrix, the domains being form-stable at normal room temperature in a first domain phase and conformable between the first and second heat transfer surface in a second domain phase, and the domains having a domain transition temperature above normal room temperature from the first domain phase to the second domain phase. The dispersed constituent may be a fusible, i.e., low temperature melting, metal or metal alloy.
114 Citations
24 Claims
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1. A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween, said interface comprising a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface, said compound comprising an admixture of:
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(a) a polymeric constituent forming a continuous matrix in said layer, said matrix being form-stable at normal room temperature in a first matrix phase and conformable between the first and second heat transfer surface in a second matrix phase, and said matrix having a matrix melting or glass transition temperature above normal room temperature from said first matrix phase to said second matrix phase; and (b) a dispersed constituent forming discrete domains within said matrix, said domains being form-stable at normal room temperature in a first domain phase and conformable between the first and second heat transfer surface in a second domain phase, and said domains having a domain melting temperature above normal room temperature from said first domain phase to said second domain phase, said domain melting temperature being between about 40-80°
C. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification