Patterned strained semiconductor substrate and device
First Claim
1. A method for forming an electrical device, the method comprising:
- forming a buffer layer in contact with a portion of a substrate, the buffer layer having a lattice constant/structure mismatch with the substrate;
forming a relaxed layer on the buffer layer;
forming a strained material on a top surface of the relaxed layer, such that the relaxed layer places the strained material in one of a tensile or a compressive state;
forming a strained device in the strained material; and
forming a non-strained device directly on the substrate adjacent the strained material.
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Accused Products
Abstract
A method that includes forming a pattern of strained material and relaxed material on a substrate; forming a strained device in the strained material; and forming a non-strained device in the relaxed material is disclosed. In one embodiment, the strained material is silicon (Si) in either a tensile or compressive state, and the relaxed material is Si in a normal state. A buffer layer of silicon germanium (SiGe), silicon carbon (SiC), or similar material is formed on the substrate and has a lattice constant/structure mis-match with the substrate. A relaxed layer of SiGe, SiC, or similar material is formed on the buffer layer and places the strained material in the tensile or compressive state. In another embodiment, carbon-doped silicon or germanium-doped silicon is used to form the strained material. The structure includes a multi-layered substrate having strained and non-strained materials patterned thereon.
116 Citations
18 Claims
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1. A method for forming an electrical device, the method comprising:
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forming a buffer layer in contact with a portion of a substrate, the buffer layer having a lattice constant/structure mismatch with the substrate; forming a relaxed layer on the buffer layer; forming a strained material on a top surface of the relaxed layer, such that the relaxed layer places the strained material in one of a tensile or a compressive state; forming a strained device in the strained material; and forming a non-strained device directly on the substrate adjacent the strained material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for forming an electrical device, the method comprising:
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etching a recess through a pad oxide layer and into a substrate; forming an insulating layer on sidewalls and a bottom of the recess; removing a portion of the insulating layer from the bottom of the recess; forming a buffer layer in the recess and between portions of the insulating layer, wherein the buffer layer is in contact with a portion of the substrate and has a lattice constant/structure mismatch with the substrate; forming a relaxed layer in the recess and between the portions of the insulating layer, wherein the relaxed layer is in contact with the buffer layer; forming a strained layer in the recess and between the portions of the insulating layer, wherein the strained layer is in contact with the relaxed layer; stripping the pad oxide layer; planarizing the substrate; forming a strained device in the strained material; and forming a non-strained device in the substrate adjacent to the strained material. - View Dependent Claims (15, 16, 17, 18)
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Specification