Wafer packaging and singulation method

• US 7,682,934 B2
• Filed: 12/14/2004
• Issued: 03/23/2010
• Est. Priority Date: 10/27/2004
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Geissler, Steven R., Chen, Chien-Hua
• Primary Examiner(s): Chiang; Jack
• Assistant Examiner(s): Duong; Khanh B.
• Application Number:
  US11/011,640
• Publication Number:
  US 20060088981A1
• Time in Patent Office: 1,925 Days
• Field of Search: 438/51, 438/55, 438/64, 438/106, 438/107, 438/118, 438/121, 438/125, 438/455, 438/456
• US Class Current: 438/458
• CPC Class Codes: B81C 1/00888 Multistep processes involving only mechanical separation, e.g. grooving followed by cleaving
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method includes providing a micro device wafer having micro devices supported by a wafer substrate and a multi-device lid substrate coupled to and spaced from the wafer substrate. The method further includes sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate.

Claims

1. A method comprising:

providing a micro device wafer having micro devices supported by a wafer substrate, wherein each micro device includes a main portion and at least one contact point electrically and physically connected to and projecting from the main portion, and a multi-device lid substrate coupled to and spaced from the wafer substrate, the multi-device lid substrate having portions opposite each main portion and spaced from each opposite main portion by an empty gap;

sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate, wherein the sawing forms an opening adjacent to at least one contact point of at least one device on an opposite side of the at least one contact point as the wafer substrate such that the at least one contact point is sandwiched between the wafer substrate and the opening; and

forming a spacer between the wafer substrate and the lid substrate, wherein the formed spacer comprises a seal between the lid substrate and the wafer substrate and about each main portion between each main portion and each contact point and wherein the seal comprises a bond ring, wherein the multi-device lid substrate has a flat face opposite the wafer substrate extending across essentially an entirety of the wafer substrate, wherein the spacer includes a portion extending between the contact points and the lid substrate.

2. The method of claim 1, wherein the opening is adjacent a first contact point of a first micro device and a second contact point of a consecutive second micro device.

3. The method of claim 2, wherein each micro device has a plurality of contact points projecting from the main portion and wherein the opening is adjacent the plurality of contact points.

4. The method of claim 1, wherein each micro device has a first contact point electrically and physically connected to and on a first side of the main portion and a second contact point on a second side of the main portion and wherein the saw is configured to form openings adjacent the first contact point and the second contact point such that the first contact point and the second contact point are sandwiched between the wafer substrate and the openings.

5. The method of claim 1, wherein the sawing forms openings extending opposite a passageway portion of the micro device wafer and wherein the micro device wafer is separated into dies along separation lines within the passageway portion.

6. The method of claim 1, wherein the multi-device lid substrate includes a glass material.

7. The method of claim 1 including coupling the bond ring to the lid substrate prior to coupling the lid substrate to the wafer substrate.

8. The method of claim 1 including coupling the bond ring to the wafer substrate prior to coupling the lid substrate to the wafer substrate.

9. The method of claim 1, wherein at least one of the micro devices includes a micro-machine.

10. The method of claim 9, wherein at least one of the micro devices includes at least one display micro-machine.

11. The method of claim 1, wherein the lid substrate is at least semi-transparent.

12. The method of claim 1, wherein the lid substrate is formed from a non-silicon material.

13. The method of claim 1 including separating the micro device wafer into dies.

14. The method of claim 1 further comprising providing a protective material between the at least one of the contact point and the lid substrate such that the at least one contact point is sandwiched between the protective material and the wafer substrate and such that the protective material is out of contact with the main portions of the micro devices and completely covers the at least one contact point during the sawing, wherein the sawing through the multi-device lid substrate forms an opening through the multi-device lid substrate and adjacent to the protective material.

15. The method of claim 14 including coating the lid substrate opposite the contact points with the protective material.

16. The method of claim 14 including removing the protective material to expose the contact points.

17. The method of claim 1 including removing the portion.

18. The method of claim 1, wherein the saw used for sawing the lid substrate has a maximum position variance and wherein the lid substrate is spaced from the wafer substrate by a distance greater than the maximum position variance.

19. The method of claim 1, wherein the sawing through the multi-device lid substrate formed a channel having a floor and wherein the method further comprises singulating the wafer substrate such that portions of a floor remain after singulation.

20. The method of claim 1, wherein the bond ring is a sole spacer between the multi-device lid substrate and the wafer substrate and wherein the bond ring is formed from a group of materials consisting of gold tin and glass frit.

21. A method comprising:

providing a micro device wafer having micro devices supported by a wafer substrate, each micro device having a main portion and a contact point electrically and physically connected to and projecting from the main portion;

coupling a multi-lid substrate to the wafer substrate such that the lid substrate is supported and spaced above the contact point of each device; and

sawing through the lid substrate to a depth between the wafer substrate and the lid substrate so as to expose the contact point of each micro device by forming an opening on an opposite side of the at least one contact point as the wafer substrate such that the at least one contact point is sandwiched between the wafer substrate and the opening, wherein the lid substrate is spaced from the wafer substrate by a bond ring extending above and next to the contact point and wherein the sawing through the lid substrate includes positioning a saw blade across from and opposite to the bond ring.

22. The method of claim 21, wherein the saw used for sawing the lid substrate has a maximum position variance and wherein the lid substrate is spaced from the wafer substrate by a distance greater than the maximum position variance.

23. The method of claim 21, wherein the sawing through the lid substrate exposes two contact points extending from two main portions of two micro devices with a single pass of a saw.

24. A method comprising:

providing a micro device wafer having micro devices supported by a wafer substrate, wherein each micro device includes a main portion and at least one contact point electrically and physically connected to and projecting from the main portion, and a multi-device lid substrate coupled to and spaced from the wafer substrate, the multi-device lid substrate having portions opposite each main portion and spaced from each opposite main portion by an empty gap;

sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate, wherein the sawing forms an opening adjacent to at least one contact point of at least one device on an opposite side of the at least one contact point as the wafer substrate such that the at least one contact point is sandwiched between the wafer substrate and the opening; and

providing a protective material between the at least one of the contact points and the lid substrate such that the at least one contact point is sandwiched between the protective material and the wafer substrate and such that the protective material is out of contact with the main portions of the micro devices, wherein the sawing through the multi-device lid substrate forms an opening through the multi-device lid substrate and adjacent to the protective material.

25. A method comprising:

providing a micro device wafer having micro devices supported by a wafer substrate, wherein each micro device includes a main portion and at least one contact point electrically and physically connected to and projecting from the main portion, and a multi-device lid substrate coupled to and spaced from the wafer substrate, the multi-device lid substrate having portions opposite each main portion and spaced from each opposite main portion by an empty gap;

sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate, wherein the sawing forms an opening adjacent to at least one contact point of at least one device on an opposite side of the at least one contact point as the wafer substrate such that the at least one contact point is sandwiched between the wafer substrate and the opening; and

forming a spacer between the wafer substrate and the lid substrate, wherein the spacer includes a portion extending between the contact points and the lid substrate.

26. A method comprising:

providing a micro device wafer having micro devices supported by a wafer substrate, wherein each micro device includes a main portion and at least one contact point electrically and physically connected to and projecting from the main portion, and a multi-device lid substrate coupled to and spaced from the wafer substrate, the multi-device lid substrate having portions opposite each main portion and spaced from each opposite main portion by an empty gap;

sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate, wherein the sawing forms an opening adjacent to at least one contact point of at least one device on an opposite side of the at least one contact point as the wafer substrate such that the at least one contact point is sandwiched between the wafer substrate and the opening; and

forming a spacer between the wafer substrate and the lid substrate, wherein the formed spacer comprises a seal between the lid substrate and the wafer substrate and about each main portion between each main portion and each contact point and wherein the seal comprises a bond ring, wherein the multi-device lid substrate has a flat face opposite the wafer substrate extending across essentially an entirety of the wafer substrate, wherein the opening is adjacent a first contact point of a first micro device and a second contact point of a consecutive second micro device.

27. The method of claim 26, wherein the first contact point and the second contact point are each exposed after the sawing to provide a contact surface for electrical connection to external devices.

28. A method comprising:

providing a micro device wafer having micro devices supported by a wafer substrate, wherein each micro device includes a main portion and at least one contact point electrically and physically connected to and projecting from the main portion, and a multi-device lid substrate coupled to and spaced from the wafer substrate, the multi-device lid substrate having portions opposite each main portion and spaced from each opposite main portion by an empty gap;

sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate, wherein the sawing forms an opening adjacent to at least one contact point of at least one device on an opposite side of the at least one contact point as the wafer substrate such that the at least one contact point is sandwiched between the wafer substrate and the opening; and

forming a spacer between the wafer substrate and the lid substrate, wherein the formed spacer comprises a seal between the lid substrate and the wafer substrate and about each main portion between each main portion and each contact point and wherein the seal comprises a bond ring, wherein the multi-device lid substrate has a flat face opposite the wafer substrate extending across essentially an entirety of the wafer substrate, wherein each micro device has a first contact point electrically and physically connected to and on a first side of the main portion and a second contact point on a second side of the main portion and wherein the saw is configured to form openings adjacent the first contact point and the second contact point such that the first contact point and the second contact point are sandwiched between the wafer substrate and the openings.

29. The method of claim 28, wherein the first contact point and the second contact point are each exposed after the sawing to provide a contact surface for electrical connection to external devices.

30. A method comprising:

providing a micro device wafer having micro devices supported by a wafer substrate, wherein each micro device includes a main portion and at least one contact point electrically and physically connected to and projecting from the main portion, and a multi-device lid substrate coupled to and spaced from the wafer substrate, the multi-device lid substrate having portions opposite each main portion and spaced from each opposite main portion by an empty gap;

sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate, wherein the sawing forms an opening adjacent to at least one contact point of at least one device on an opposite side of the at least one contact point as the wafer substrate such that the at least one contact point is sandwiched between the wafer substrate and the opening;

forming a spacer between the wafer substrate and the lid substrate, wherein the formed spacer comprises a seal between the lid substrate and the wafer substrate and about each main portion between each main portion and each contact point and wherein the seal comprises a bond ring, wherein the multi-device lid substrate has a flat face opposite the wafer substrate extending across essentially an entirety of the wafer substrate;

providing a protective material between the at least one of the contact point and the lid substrate such that the at least one contact point is sandwiched between the protective material and the wafer substrate and such that the protective material is out of contact with the main portions of the micro devices, wherein the sawing through the multi-device lid substrate forms an opening through the multi-device lid substrate and adjacent to the protective material; and

removing the protective material to expose the contact points.

31. The method of claim 30, wherein the protective material completely covers the at least one contact point during the sawing.

32. The method of claim 30, wherein the removing of the protective material to expose the contact points is performed after completion of the sawing.