Low power pulse modulation communication in mesh networks with modular sensors
First Claim
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1. A sensor module comprising:
- a power plane that includes a power source and a communications module;
a processing plane including a processor and memory, the processing place in electrical and mechanical communication with the power plane with a first flex circuit that extends from the power to the processing plane such that a portion of the first flex circuit is exterior to the power plane and the processing plane;
a sensing plane that includes one or more sensors, the sensing plane in mechanical and electrical communication with the processing plane with a second flex circuit that extends from the processing to the sensing plane such that a portion of the second flex circuit is exterior to the processing plane and the sensing plane; and
wherein the flex circuits permit the power plane, processing plane, and sensing plane to fold into a stacked package.
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Abstract
A modular sensor architecture. A sensor includes multiple planes that are in electrical communication. A power plane provides a power source and a communications module that can be optical and/or electrical in nature. The power source can be upgraded using optical power delivered over an optical fiber. The sensor can also both transmit/receive data over the optical fiber. A processing plane provides memory and processing power. The processing plane can be updated/upgraded via the communications module or the optical fiber. A sensor plane includes multiple sensors. Deployed sensors can transmit and receive data or programming using mesh networks and using low power pulse modulation.
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Citations
7 Claims
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1. A sensor module comprising:
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a power plane that includes a power source and a communications module; a processing plane including a processor and memory, the processing place in electrical and mechanical communication with the power plane with a first flex circuit that extends from the power to the processing plane such that a portion of the first flex circuit is exterior to the power plane and the processing plane; a sensing plane that includes one or more sensors, the sensing plane in mechanical and electrical communication with the processing plane with a second flex circuit that extends from the processing to the sensing plane such that a portion of the second flex circuit is exterior to the processing plane and the sensing plane; and wherein the flex circuits permit the power plane, processing plane, and sensing plane to fold into a stacked package. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification