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Low power pulse modulation communication in mesh networks with modular sensors

  • US 7,683,775 B2
  • Filed: 11/30/2006
  • Issued: 03/23/2010
  • Est. Priority Date: 11/30/2005
  • Status: Active Grant
First Claim
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1. A sensor module comprising:

  • a power plane that includes a power source and a communications module;

    a processing plane including a processor and memory, the processing place in electrical and mechanical communication with the power plane with a first flex circuit that extends from the power to the processing plane such that a portion of the first flex circuit is exterior to the power plane and the processing plane;

    a sensing plane that includes one or more sensors, the sensing plane in mechanical and electrical communication with the processing plane with a second flex circuit that extends from the processing to the sensing plane such that a portion of the second flex circuit is exterior to the processing plane and the sensing plane; and

    wherein the flex circuits permit the power plane, processing plane, and sensing plane to fold into a stacked package.

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