MEMS using filler material and method
First Claim
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1. A microelectromechanical systems device comprising:
- a substrate;
a deformable layer;
a support structure supporting the deformable layer;
a movable conductor positioned vertically between the substrate and the deformable layer, wherein at least a portion of the movable conductor is electrically conductive; and
a connector securing the movable conductor to the deformable layer vertically below the deformable layer;
whereinat least one of the connector and the support structure comprises a first component and a second component,at least a portion of the first component is disposed on a perimeter of at least one of the connector and the support structure such that at least a portion of the first component is horizontally adjacent to and forms sides of at least a lower portion of the second component;
the second component forms a core of the at least one of the connector and the support structure; and
the first component comprises a non-electrically conductive filler material, wherein the filler material is a spin-on material.
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Abstract
Described is an apparatus, method for manufacturing, and systems comprising a MEMS device, for example, an interferometric modulator, comprising a substrate, a movable mirror, a deformable layer, and a support structure. In some embodiments, the support structure comprises a plurality of support posts. A connector secures the movable mirror secured to the deformable layer. At least one of the connector and the support post is a composite comprising a first component and a second component, where at the first component forms at least a portion of at least one of the perimeter of the connector and support post.
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Citations
19 Claims
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1. A microelectromechanical systems device comprising:
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a substrate; a deformable layer; a support structure supporting the deformable layer; a movable conductor positioned vertically between the substrate and the deformable layer, wherein at least a portion of the movable conductor is electrically conductive; and a connector securing the movable conductor to the deformable layer vertically below the deformable layer; wherein at least one of the connector and the support structure comprises a first component and a second component, at least a portion of the first component is disposed on a perimeter of at least one of the connector and the support structure such that at least a portion of the first component is horizontally adjacent to and forms sides of at least a lower portion of the second component; the second component forms a core of the at least one of the connector and the support structure; and the first component comprises a non-electrically conductive filler material, wherein the filler material is a spin-on material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification