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Multi-layer capacitor and integrated circuit module

  • US 7,684,170 B2
  • Filed: 06/25/2004
  • Issued: 03/23/2010
  • Est. Priority Date: 06/25/2004
  • Status: Expired due to Fees
First Claim
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1. A multi-layer capacitor comprising:

  • a number of electrically insulating layers stacked on top of one another;

    first and second electrode plates arranged in parallel with one another between the insulating layers, wherein the first and second electrode plates are arranged spaced apart from one another above one another alternating with an intermediate insulating layer;

    at least one first connecting line extending perpendicularly through the insulating layers, which is connected to the first electrode plates and is insulated from the second electrode plates;

    second connecting lines extending perpendicularly through the insulating layers, which are connected to the second electrode plates and are insulated from the first electrode plates,wherein one of said at least one first connecting line provided for application of a radio-frequency signal extends centrally through the stacked first and second electrode plates, andwherein further first connecting lines of said at least one first connecting line are arranged distributed symmetrically around the one first connecting line on a circumference.

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